Transparent bulk silica porous material with uniform pore size and
distribution
    1.
    发明授权
    Transparent bulk silica porous material with uniform pore size and distribution 失效
    透明的本体二氧化硅多孔材料具有均匀的孔径和分布

    公开(公告)号:US5958577A

    公开(公告)日:1999-09-28

    申请号:US3461

    申请日:1998-01-06

    摘要: The method for producing a bulk silica porous material is presented. The obtained material has a large crystal size serving to reduce light scattering, and uniform and adjustable pore size. This can be utilized for optical and electronic functional materials. The method comprises the steps of:forming a silica/surfactant composite by mixing starting materials containing an alkoxysilane, water and a surfactant and allowing to the starting materials to react;maturing said silica/surfactant composite by allowing the same to stand in a closed container to effect the development of a silica network structure and the formation of porous structure in said composite;drying said matured silica/surfactant composite for removing the solvent and for condensation of said matured silica/surfactant composite; and,sintering said condensed silica/surfactant composite to remove the surfactant to obtain a silica porous material.

    摘要翻译: 介绍了本体二氧化硅多孔材料的生产方法。 所得材料具有大的晶体尺寸,用于减少光散射,孔径均匀可调。 这可以用于光学和电子功能材料。 该方法包括以下步骤:通过混合含有烷氧基硅烷,水和表面活性剂的原料并使原料反应形成二氧化硅/表面活性剂复合物; 使所述二氧化硅/表面活性剂复合物通过使其相对于密闭容器中成熟而实现二氧化硅网络结构的发展和在所述复合材料中形成多孔结构; 干燥所述成熟的二氧化硅/表面活性剂复合物,用于除去溶剂并使所述成熟的二氧化硅/表面活性剂复合物冷凝; 并烧结所述缩合二氧化硅/表面活性剂复合物以除去表面活性剂以获得二氧化硅多孔材料。

    Electronic component and producing method thereof
    2.
    发明授权
    Electronic component and producing method thereof 有权
    电子元件及其制造方法

    公开(公告)号:US08797711B2

    公开(公告)日:2014-08-05

    申请号:US12632823

    申请日:2009-12-08

    IPC分类号: H01G4/228

    CPC分类号: H01G4/30 H01G4/232

    摘要: A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.

    摘要翻译: 在形成外部电极的电子部件中,通过直接对构成体的表面的特定区域进行电镀,能够精确地控制形成有构成外部电极的镀膜的区域。 在构成体中,在形成有外部电极的区域被分隔的位置设置凸块。 在电镀工艺中,构成外部电极的镀膜的生长在凸块中基本上停止或延迟。 结果,可以在凸块的位置上精确地控制构成外部电极的镀膜的生长终止点。

    Laminated electronic component and method for manufacturing the same
    3.
    发明授权
    Laminated electronic component and method for manufacturing the same 有权
    层压电子部件及其制造方法

    公开(公告)号:US08730646B2

    公开(公告)日:2014-05-20

    申请号:US12466435

    申请日:2009-05-15

    IPC分类号: H01G4/008 H01G2/20 H01G4/228

    CPC分类号: H01G4/005 H01G4/008 H01G4/232

    摘要: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.

    摘要翻译: 层叠电子部件包括外部端子电极,其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜,下部电镀膜通过直接电镀电子部件主体的外表面而形成,使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜,上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。

    Ceramic electronic component and manufacturing method therefor
    4.
    发明授权
    Ceramic electronic component and manufacturing method therefor 有权
    陶瓷电子元件及其制造方法

    公开(公告)号:US08411409B2

    公开(公告)日:2013-04-02

    申请号:US13161535

    申请日:2011-06-16

    IPC分类号: H01G4/30

    摘要: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.

    摘要翻译: 当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时,即使在不希望的位置也可能产生电镀生长。 由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域 其具有相对较低的电镀生长。 构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成,使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉 在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。

    Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress
    5.
    发明授权
    Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress 有权
    包括具有低膜应力的镀层的外部电极的多层陶瓷电子部件

    公开(公告)号:US08154848B2

    公开(公告)日:2012-04-10

    申请号:US12354026

    申请日:2009-01-15

    IPC分类号: H01G4/228 H01G4/06

    摘要: A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.

    摘要翻译: 多层陶瓷电子部件包括层叠体,其包括多个陶瓷层的叠层和沿着陶瓷层之间的界面延伸的多个内部电极,以及电连接在层叠体的表面露出的内部电极的多个外部电极。 每个外部电极至少包括直接连接到内部电极的部分的镀层。 镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。

    Conversion of bit lengths into codes
    6.
    发明授权
    Conversion of bit lengths into codes 失效
    将位长转换为代码

    公开(公告)号:US08018359B2

    公开(公告)日:2011-09-13

    申请号:US12753784

    申请日:2010-04-02

    IPC分类号: H03M7/46

    CPC分类号: H03M7/42

    摘要: Various embodiments are provided to reduce a processing time taken when plural bit lengths each assigned to plural strings are converted into plural codes. In one exemplary embodiment, in response to input of the plurality of bit lengths, a number of strings assigned each of the bit lengths, a bit length assigned to each of the strings, and a sequence number of each string in a group of strings assigned each of the bit lengths are recorded. A plurality of base codes are generated on the basis of the numbers of the strings recorded by the recording unit, the base codes each being a code used as a base for codes having the same one of the bit lengths. A plurality of codes is generated by performing in parallel a plurality of processes respectively for the plurality of strings.

    摘要翻译: 提供了各种实施例,以减少每个分配给多个字符串的多个位长度被转换成多个代码所需的处理时间。 在一个示例性实施例中,响应于多个比特长度的输入,分配每个比特长度的字符串的数量,分配给每个字符串的比特长度以及被分配的一组字符串中的每个字符串的序列号 记录每个位长度。 基于由记录单元记录的串的数量生成多个基本码,每个基准码是用作具有相同比特长度的码的基础的码。 通过分别并行地执行多个字符串来生成多个代码。

    Multilayer electronic component and method for manufacturing the same
    7.
    发明授权
    Multilayer electronic component and method for manufacturing the same 有权
    多层电子元件及其制造方法

    公开(公告)号:US07764484B2

    公开(公告)日:2010-07-27

    申请号:US12142924

    申请日:2008-06-20

    IPC分类号: H01G4/00

    摘要: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.

    摘要翻译: 一种制造多层电子部件的方法包括制备层压体的步骤,该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极,并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤,以及在导电粒子的规定表面上直接进行电镀的工序 附上。

    Semiconductor circuit for detecting a signal propagation time
    10.
    发明授权
    Semiconductor circuit for detecting a signal propagation time 有权
    用于检测信号传播时间的半导体电路

    公开(公告)号:US07382171B2

    公开(公告)日:2008-06-03

    申请号:US10779802

    申请日:2004-02-18

    IPC分类号: H03H11/26

    CPC分类号: H03K5/13 G06K9/62

    摘要: There is provided a semiconductor circuit including three or more nodes at least including one input node and one output node, plural paths which are connected between the three or more nodes and whose signal propagation directions between the nodes are regulated, a signal propagation time regulator for regulating a signal propagation time of each of the paths, an input unit for inputting a predetermined input signal to the input node, and a detector for detecting a time required for the input signal to propagate through the paths and arrive at the output node.

    摘要翻译: 提供了包括三个或更多个节点的半导体电路,至少包括一个输入节点和一个输出节点,连接在三个或更多个节点之间的多个路径,并且其节点之间的信号传播方向被调节,信号传播时间调节器 调节每个路径的信号传播时间,用于向输入节点输入预定输入信号的输入单元,以及检测器,用于检测输入信号通过路径传播并到达输出节点所需的时间。