摘要:
A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. The horn has a cross-section variable section in which a cross section perpendicular to the lengthwise direction (X direction) thereof has a first region extending in the Z direction and a pair of second regions sandwiching the first region from Y direction. In the position P3 corresponding to an anti-node of a standing wave of oscillations excited in the horn, a sectional area S1 of the first region assumes a maximum and a sectional area S2 of the second region assumes a minimum. With a transition from the position P3 to the other positions corresponding to nodes, the sectional area S1 decreases and the sectional area S2 increases. As a result, oscillation components other than those in the X direction are suppressed.
摘要:
A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. In the horn 50 in accordance with the present invention, oscillations are applied by an oscillator 42. The horn 50 has a cross-section variable section 54 in which a cross section perpendicular to the lengthwise direction (X direction) of the horn 50 has a first region A1 extending in the Z direction and a pair of second regions A2 sandwiching the first region A1 from the direction (Y direction) perpendicular to the Z direction. In the position P3 corresponding to an anti-node of a standing wave of oscillations excited in the horn 50, a sectional area S1 of the first region A1 assumes a maximum and a sectional area S2 of the second region A2 assumes a minimum. With a transition from the position P3 corresponding to an anti-node of the standing wave to positions P2, P4 corresponding to nodes, the sectional area S1 of the first region Al decreases and the sectional area S2 of the second region A2 increases. As a result, oscillation components other than those in the X direction are suppressed.
摘要:
In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.
摘要:
A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.
摘要:
In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.
摘要:
A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.
摘要:
An automotive lamp includes an LED, a substrate that mounts the LED, a reflector that reflects the light emitted from the LED, and an projection lens having an incident surface, which receives the light reflected by the reflector, and an emission surface that emits the light toward a front area of the automotive lamp. A fine asperity structure is formed on the incident surface of the projection lens. The fine asperity structure includes recesses or raised portions formed with the pitch less than or equal to the visible light wavelength.
摘要:
An organic EL panel including at least a light-emitting part and a sealing structure. The light-emitting part further includes at least an organic EL element formed on a substrate. The sealing structure further includes a sealing adhesive layer that contacts a coating film. The organic EL panel emits light from the light-emitting part through the substrate. The organic EL element includes at least the organic layer formed on a first electrode. The organic EL element further includes a second electrode formed on the at least one organic layer. The organic EL panel further includes the coating film coating the light-emitting part. A surface of the sealing adhesive forms a convex part formed by an inorganic material. A surface of the coating film forms a concave part that contacts the convex part.
摘要:
A liquid silicone rubber composition comprising an alkenyl group-containing liquid organopolysiloxane, a reinforcing silica filler, an organohydrogenpolysiloxane, a platinum group catalyst, a liquid organopolysiloxane that is free of crosslinking groups and is compatible with the alkenyl group-containing liquid organopolysiloxane, and a liquid organopolysiloxane that is free of crosslinking groups and is incompatible with the alkenyl group-containing liquid organopolysiloxane, wherein the cured material therefrom has a JIS type A durometer hardness of 15 to 26 and a tensile stress at 100% elongation of 0.25 to 0.60 MPa. Also, a through hole-containing sealing member comprising this cured material.
摘要:
A method of manufacturing an organic EL panel includes forming a light-emitting part having at least one organic EL element on a panel substrate, forming a concave portion for housing the light-emitting part on a sealing substrate, and sealing the light-emitting part by bonding the panel substrate and the sealing substrate together through an adhesive layer. A supporting projection projecting toward the panel substrate is formed while the concave portion is being formed, and a supporting margin facing the bottom face of the supporting projection is provided where the organic EL elements are not formed within a region of the light-emitting part on the panel substrate.