-
公开(公告)号：US06860087B2
公开(公告)日：2005-03-01
申请号：US09942996
申请日：2001-08-31
CPC分类号： B65D85/66 , F24H3/0405 , G03C3/00
摘要： A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
-
公开(公告)号：US07032361B2
公开(公告)日：2006-04-25
申请号：US10327979
申请日：2002-12-26
CPC分类号： B65B25/148 , B65B25/146 , G03C3/02
摘要： A system for automatically packaging photosensitive rolls includes a flanged member installing device for selecting flanged members corresponding to a photosensitive roll and automatically installing the flanged members respectively on opposite ends of the photosensitive roll, a tape member applying device for automatically applying a joint tape to an end of the photosensitive roll, a packaging sheet working device for automatically processing light-shielding leaders to dimensions corresponding to the photosensitive roll, an applying mechanism for automatically applying the processed light-shielding leaders to the photosensitive roll, and a packaging sheet takeup device for automatically winding the light-shielding leaders around the photosensitive roll.
-
公开(公告)号：US07988803B2
公开(公告)日：2011-08-02
申请号：US12684548
申请日：2010-01-08
CPC分类号： H01L21/67132 , H01L21/67766 , H01L21/67778 , H01L21/681 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L2221/68395 , H01L2924/0002 , H01L2924/00
摘要： A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
摘要翻译： 用于连接基板（11）的装置设置在清洁间（12）的内部。 单轴机器人（46）和五轴机器人（47）传送晶片（25）和玻璃基板（33）。 抄录台（91）从胶片供给部（113）获得涂布有粘合剂的转录膜（112），并将转印膜（112）按压到玻璃基板（33），以将粘合剂转印到 玻璃基板（33）。 剥离站（92）从玻璃基板（33）剥离转印膜（112）。 接合台（57）将晶片（25）和玻璃基板（33）定位，调整晶片（25）和玻璃基板（33）的接合面的平行度，并将这些基板接合在一起。 由于晶片（25）的处理和接合，玻璃基板（33）和转印膜（112）在清洁室中进行，因此防止产品的屈服比由于外部的粘附而降低 事情
-
公开(公告)号：US07678211B2
公开(公告)日：2010-03-16
申请号：US10594069
申请日：2005-03-23
CPC分类号： H01L21/67132 , H01L21/67766 , H01L21/67778 , H01L21/681 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L2221/68395 , H01L2924/0002 , H01L2924/00
摘要： A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
摘要翻译： 用于连接基板（11）的装置设置在清洁间（12）的内部。 单轴机器人（46）和五轴机器人（47）传送晶片（25）和玻璃基板（33）。 抄录台（91）从胶片供给部（113）获得涂布有粘合剂的转录膜（112），并将转印膜（112）按压到玻璃基板（33），以将粘合剂转印到 玻璃基板（33）。 剥离站（92）从玻璃基板（33）剥离转印膜（112）。 接合台（57）将晶片（25）和玻璃基板（33）定位，调整晶片（25）和玻璃基板（33）的接合面的平行度，并将这些基板接合在一起。 由于晶片（25）的处理和接合，玻璃基板（33）和转印膜（112）在清洁室中进行，因此防止产品的屈服比由于外部的粘附而降低 事情
-
公开(公告)号：US07003221B2
公开(公告)日：2006-02-21
申请号：US10898346
申请日：2004-07-26
申请人： Koji Tsujimura
发明人： Koji Tsujimura
IPC分类号： F24H1/10
CPC分类号： B65D85/66 , F24H3/0405 , G03C3/00
摘要： A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
-
公开(公告)号：US20100108237A1
公开(公告)日：2010-05-06
申请号：US12684548
申请日：2010-01-08
CPC分类号： H01L21/67132 , H01L21/67766 , H01L21/67778 , H01L21/681 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L2221/68395 , H01L2924/0002 , H01L2924/00
摘要： A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
摘要翻译： 用于连接基板（11）的装置设置在清洁间（12）的内部。 单轴机器人（46）和五轴机器人（47）传送晶片（25）和玻璃基板（33）。 抄录台（91）从胶片供给部（113）获得涂布有粘合剂的转录膜（112），并将转印膜（112）按压到玻璃基板（33），以将粘合剂转印到 玻璃基板（33）。 剥离站（92）从玻璃基板（33）剥离转印膜（112）。 接合台（57）将晶片（25）和玻璃基板（33）定位，调整晶片（25）和玻璃基板（33）的接合面的平行度，并将这些基板接合在一起。 由于晶片（25）的处理和接合，玻璃基板（33）和转印膜（112）在清洁室中进行，因此防止产品的屈服比由于外部的粘附而降低 事情
-
公开(公告)号：US20070194438A1
公开(公告)日：2007-08-23
申请号：US10594069
申请日：2005-03-23
IPC分类号： H01L23/12
CPC分类号： H01L21/67132 , H01L21/67766 , H01L21/67778 , H01L21/681 , H01L27/14618 , H01L27/14632 , H01L27/14687 , H01L31/0203 , H01L2221/68395 , H01L2924/0002 , H01L2924/00
摘要： A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
摘要翻译： 用于连接基板（11）的装置设置在清洁间（12）的内部。 单轴机器人（46）和五轴机器人（47）传送晶片（25）和玻璃基板（33）。 抄录台（91）从胶片供给部（113）获得涂布有粘合剂的转录膜（112），并将转印膜（112）按压到玻璃基板（33），以将粘合剂转印到 玻璃基板（33）。 剥离站（92）从玻璃基板（33）剥离转印膜（112）。 接合台（57）将晶片（25）和玻璃基板（33）定位，调整晶片（25）和玻璃基板（33）的接合面的平行度，并将这些基板接合在一起。 由于晶片（25）的处理和接合，玻璃基板（33）和转印膜（112）在清洁室中进行，因此防止产品的屈服比由于外部的粘附而降低 事情
-
8.发明申请Method of and apparatus for packaging light-shielding photosensitive material roll, and apparatus for heating and supplying fluid 失效用于封装光屏蔽感光材料卷的方法和装置，以及用于加热和供应流体的装置公开(公告)号：US20050008349A1
公开(公告)日：2005-01-13
申请号：US10898346
申请日：2004-07-26
申请人： Koji Tsujimura
发明人： Koji Tsujimura
CPC分类号： B65D85/66 , F24H3/0405 , G03C3/00
摘要： A packaging apparatus has hot air supply mechanisms disposed in association with light-shielding shrinkable films wound on a rolled photosensitive material sheet, for ejecting hot air locally to the light-shielding shrinkable films, and a drive mechanism for relatively rotating the hot air supply mechanisms along an outer circumferential surface of the rolled photosensitive material sheet.
摘要翻译： 包装装置具有与卷绕在卷筒状光敏材料片上的遮光性收缩薄膜相关联地设置的热风供给机构，用于将热空气局部地喷射到遮光性收缩膜上;以及驱动机构，其使热风供给机构 沿着卷绕的感光材料片的外周表面。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.025 秒)