公开(公告)号：US20050253143A1

公开(公告)日：2005-11-17

申请号：US11168872

申请日：2005-06-29

申请人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

发明人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

IPC分类号： G11C11/41 ,  H01L21/8234 ,  H01L21/8244 ,  H01L27/00 ,  H01L27/06 ,  H01L27/088 ,  H01L27/10 ,  H01L27/11 ,  H01L29/10

CPC分类号： H01L27/11 ,  H01L27/0688 ,  H01L27/1104

摘要： The invention provides a semiconductor memory device comprising a plurality of word lines, a plurality of bit lines, and a plurality of static memory cells each having a first, second, third, fourth, fifth, and sixth transistors. While each of channels of the first, second, third, and fourth transistors are formed vertical against a substrate of the semiconductor memory device. Each of semiconductor regions forming a source or a drain of the fifth and sixth transistors forms a PN junction against the substrate. According to another aspect of the invention, the SRAM device of the invention has a plurality of SRAM cells, at least one of which is a vertical SRAM cell comprising at least four vertical transistors onto a substrate, and each vertical transistor includes a source, a drain, and a channel therebetween aligning in one aligning line which penetrates into the substrate surface at an angle greater than zero degree.

摘要翻译： 本发明提供一种包括多个字线，多个位线以及多个静态存储单元的半导体存储器件，每个静态存储器单元具有第一，第二，第三，第四，第五和第六和第六晶体管。 尽管第一，第二，第三和第四晶体管的每个通道与半导体存储器件的衬底垂直地形成。 形成第五晶体管和第六晶体管的源极或漏极的半导体区域形成与衬底相反的PN结。 根据本发明的另一方面，本发明的SRAM器件具有多个SRAM单元，其中至少一个是在衬底上包括至少四个垂直晶体管的垂直SRAM单元，并且每个垂直晶体管包括源极， 排水管和其间的通道在以大于零度的角度穿入衬底表面的一个对准线对中。

公开(公告)号：US06943373B2

公开(公告)日：2005-09-13

申请号：US10693987

申请日：2003-10-28

申请人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

发明人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

IPC分类号： G11C11/41 ,  H01L21/8234 ,  H01L21/8244 ,  H01L27/00 ,  H01L27/06 ,  H01L27/088 ,  H01L27/10 ,  H01L27/11 ,  H01L29/10 ,  H01L29/72

CPC分类号： H01L27/11 ,  H01L27/0688 ,  H01L27/1104

摘要： The invention provides a semiconductor memory device comprising a plurality of word lines, a plurality of bit lines, and a plurality of static memory cells each having a first, second, third, fourth, fifth, and sixth transistors. While each of channels of the first, second, third, and fourth transistors are formed vertical against a substrate of the semiconductor memory device. Each of semiconductor regions forming a source or a drain of the fifth and sixth transistors forms a PN junction against the substrate. According to another aspect of the invention, the SRAM device of the invention has a plurality of SRAM cells, at least one of which is a vertical SRAM cell comprising at least four vertical transistors onto a substrate, and each vertical transistor includes a source, a drain, and a channel therebetween aligning in one aligning line which penetrates into the substrate surface at an angle greater than zero degree.

公开(公告)号：US07098478B2

公开(公告)日：2006-08-29

申请号：US11168872

申请日：2005-06-29

申请人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

发明人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

IPC分类号： H01L29/72

CPC分类号： H01L27/11 ,  H01L27/0688 ,  H01L27/1104

摘要： The invention provides a semiconductor memory device comprising a plurality of word lines, a plurality of bit lines, and a plurality of static memory cells each having a first, second, third, fourth, fifth, and sixth transistors. While each of channels of the first, second, third, and fourth transistors are formed vertical against a substrate of the semiconductor memory device. Each of semiconductor regions forming a source or a drain of the fifth and sixth transistors forms a PN junction against the substrate. According to another aspect of the invention, the SRAM device of the invention has a plurality of SRAM cells, at least one of which is a vertical SRAM cell comprising at least four vertical transistors onto a substrate, and each vertical transistor includes a source, a drain, and a channel therebetween aligning in one aligning line which penetrates into the substrate surface at an angle greater than zero degree.

公开(公告)号：US06670642B2

公开(公告)日：2003-12-30

申请号：US10051188

申请日：2002-01-22

申请人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

发明人： Norikatsu Takaura ,  Hideyuki Matsuoka ,  Riichiro Takemura ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Akio Nishida ,  Kota Funayama ,  Tomonori Sekiguchi

IPC分类号： H01L2972

CPC分类号： H01L27/11 ,  H01L27/0688 ,  H01L27/1104

摘要： The invention provides a semiconductor memory device comprising a plurality of word lines, a plurality of bit lines, and a plurality of static memory cells each having a first, second, third, fourth, fifth, and sixth transistors. While each of channels of the first, second, third, and fourth transistors are formed vertical against a substrate of the semiconductor memory device. Each of semiconductor regions forming a source or a drain of the fifth and sixth transistors forms a PN junction against the substrate. According to another aspect of the invention, the SRAM device of the invention has a plurality of SRAM cells, at least one of which is a vertical SRAM cell comprising at least four vertical transistors onto a substrate, and each vertical transistor includes a source, a drain, and a channel therebetween aligning in one aligning line which penetrates into the substrate surface at an angle greater than zero degree.

公开(公告)号：US07972920B2

公开(公告)日：2011-07-05

申请号：US12700344

申请日：2010-02-04

申请人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L21/8244 ,  G11C11/40

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。

公开(公告)号：US07161215B2

公开(公告)日：2007-01-09

申请号：US11418029

申请日：2006-05-05

申请人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L29/78 ,  G11C11/412

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。

公开(公告)号：US20100136778A1

公开(公告)日：2010-06-03

申请号：US12700344

申请日：2010-02-04

申请人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L21/28

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。

公开(公告)号：US07701020B2

公开(公告)日：2010-04-20

申请号：US12364279

申请日：2009-02-02

申请人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L27/088

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。

公开(公告)号：US20090140342A1

公开(公告)日：2009-06-04

申请号：US12364279

申请日：2009-02-02

申请人： Hiraku CHAKIHARA ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku CHAKIHARA ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L29/78

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。

公开(公告)号：US07495289B2

公开(公告)日：2009-02-24

申请号：US11418024

申请日：2006-05-05

申请人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

发明人： Hiraku Chakihara ,  Kousuke Okuyama ,  Masahiro Moniwa ,  Makoto Mizuno ,  Keiji Okamoto ,  Mitsuhiro Noguchi ,  Tadanori Yoshida ,  Yasuhiko Takahshi ,  Akio Nishida

IPC分类号： H01L29/78 ,  G11C11/412

CPC分类号： H01L29/6675 ,  H01L21/823885 ,  H01L27/105 ,  H01L27/11 ,  H01L27/1104 ,  H01L27/1116 ,  H01L29/7833 ,  H01L29/78642

摘要： Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.

摘要翻译： 垂直MISFET形成在驱动MISFET和传输MISFET上。 垂直MISFET包括通过层叠下半导体层（漏极），中间半导体层和上半导体层（源极）形成的矩形柱层叠体以及在层叠体的相应侧壁上形成有栅极绝缘膜的栅电极 插入其间。 在每个垂直MISFET中，下半导体层构成漏极，中间半导体层构成衬底（沟道区），上半导体层构成源极。 下半导体层，中间半导体层和上半导体层均由硅膜构成。 下半导体层和上半导体层掺杂有p型并由p型硅膜构成。