公开(公告)号：US07166361B2

公开(公告)日：2007-01-23

申请号：US10239189

申请日：2001-03-29

申请人： Hideo Baba ,  Nozomu Takano ,  Kazuhiro Miyauchi

发明人： Hideo Baba ,  Nozomu Takano ,  Kazuhiro Miyauchi

IPC分类号： B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  C08L83/04

CPC分类号： C08G77/38 ,  C08G77/12 ,  C08G77/388 ,  H05K1/032 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/31663

摘要： A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R′m(H)kSiX4−(m+k)  (I) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R′ is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.

摘要翻译： 一种硅氧烷聚合物的制造方法，其特征在于，包括使通式（I）表示的硅烷化合物含有35〜100摩尔％的硅烷化合物的水解缩聚反应的步骤： 描述=“在线公式”end =“lead”？> R'（H） SiX 4（m + k）（其中X是可水解和缩聚基团，例如卤素原子（例如氯或溴）或 - OR; R为1〜4个碳原子的烷基或1〜4个碳原子的烷基羰基; R'为非反应性基团，例如1〜4个碳原子的烷基或芳基（ 例如苯基）;“k”为1或2;“m”为0或1;“m + k”为1或2），并进一步用氢化硅烷化剂进行氢化硅烷化反应。

公开(公告)号：US07736749B2

公开(公告)日：2010-06-15

申请号：US11537122

申请日：2006-09-29

申请人： Hideo Baba ,  Nozomu Takano ,  Kazuhiro Miyauchi

发明人： Hideo Baba ,  Nozomu Takano ,  Kazuhiro Miyauchi

IPC分类号： B32B15/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07 ,  C08K3/00

CPC分类号： C08G77/38 ,  C08G77/12 ,  C08G77/388 ,  H05K1/032 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/31663

摘要： A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R′m(H)kSiX4−(m+k)  (I) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R′ is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.

摘要翻译： 一种硅氧烷聚合物的制造方法，其特征在于，包括使通式（I）表示的硅烷化合物含有35〜100摩尔％的硅烷化合物的水解缩聚反应的步骤：R'm（H）kSiX4 - （m + k）（I）（其中X是可水解和缩聚基团，例如卤素原子（例如氯或溴）或-OR; R是1至4个碳原子的烷基或烷基羰基 1至4个碳原子的基团; R'是非反应性基团，例如1至4个碳原子的烷基或芳基（例如苯基）;“k”是1或2;“m “为0或1;”m + k“为1或2），并进一步使所得产物与氢化硅烷化剂进行氢化硅烷化反应。

公开(公告)号：US06787614B2

公开(公告)日：2004-09-07

申请号：US10127467

申请日：2002-04-23

申请人： Nozomu Takano ,  Kazuhiro Miyauchi ,  Hideo Baba

发明人： Nozomu Takano ,  Kazuhiro Miyauchi ,  Hideo Baba

IPC分类号： C08G7738

CPC分类号： H05K1/0313 ,  C08G59/5073 ,  C08L2666/14 ,  C09J163/00

摘要： There is here disclosed a thermosetting resin composition containing, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer having a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule.

摘要翻译： 这里公开了一种热固性树脂组合物，其含有（a）环氧树脂，（b）固化剂和（c）具有由式R 2 SiO 2/2表示的双功能硅氧烷单元的硅氧烷聚合物作为必要成分（其中R 是相同或不同的有机基团）。

公开(公告)号：US20110001251A1

公开(公告)日：2011-01-06

申请号：US12667398

申请日：2008-07-03

申请人： Yutaka Gou ,  Kazuhiro Miyauchi ,  Takashi Inoue ,  Atsushi Takahara ,  Hiroshi Jinnai

发明人： Yutaka Gou ,  Kazuhiro Miyauchi ,  Takashi Inoue ,  Atsushi Takahara ,  Hiroshi Jinnai

IPC分类号： H01L23/52 ,  H01L21/60 ,  C09J163/00 ,  B32B37/12

CPC分类号： C09J163/00 ,  C08F2220/325 ,  C08G59/3209 ,  C08G59/5006 ,  C08G59/5033 ,  C08L33/068 ,  C08L63/00 ,  C08L2205/22 ,  C08L2312/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/22 ,  C09J133/06 ,  C09J133/068 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： Disclosed is an adhesive composition, comprising, as essential components, a thermosetting resin component A and a high-molecular component B which are evenly compatible and miscible with each other at a temperature of 5 to 40° C. without being separated from each other, and a curing agent component C,wherein after the adhesive composition comes into contact with an adherend and after the thermosetting resin component A is cured, the thermosetting resin component A is separated, in the adhesive composition, into particulate structures wherein the concentration of the thermosetting resin component A is larger than that in the surrounding of the particulate structures, and further the particulate structures are formed in a larger amount near a surface of the composition which contacts the adherend than inside the adhesive composition. The adhesive composition can be used in thin-film bonding. it is possible to provide an adhesive composition excellent in heat resistance, crack resistance, adhesive property, and exudation resistance, which is property that the adhesive less exudes.

摘要翻译： 公开了一种粘合剂组合物，其包含作为必要组分的热固性树脂组分A和高分子组分B，其在5至40℃的温度下彼此均匀地相容并且可混溶，而不彼此分离， 和固化剂成分C，其中在粘合剂组合物与被粘物接触之后，并且在热固性树脂组分A固化之后，将热固性树脂组分A在粘合剂组合物中分离成颗粒结构，其中热固性 树脂组分A大于颗粒结构周围的树脂组分A，并且在粘合剂组合物内比接触被粘物的组合物的表面附近还形成更多的颗粒结构。 粘合剂组合物可用于薄膜粘合。 可以提供耐热性，抗裂纹性，粘合性和耐渗出性优异的粘合剂组合物，这是粘合剂较少渗出的特性。

公开(公告)号：US07016749B2

公开(公告)日：2006-03-21

申请号：US10267569

申请日：2002-10-10

申请人： Seigo Kuzumaki ,  Yoshio Shirai ,  Takatoshi Negishi ,  Kazuhiro Miyauchi ,  Masato Kato ,  Katsuhiko Kato ,  Yasushi Okamoto ,  Shouichi Okumura ,  Mikio Sato ,  Yoshiki Konishi ,  Morio Oba ,  Koji Sato ,  Junichi Harada ,  Shigeharu Ueyama ,  Koji Eguchi ,  Goro Takahashi

发明人： Seigo Kuzumaki ,  Yoshio Shirai ,  Takatoshi Negishi ,  Kazuhiro Miyauchi ,  Masato Kato ,  Katsuhiko Kato ,  Yasushi Okamoto ,  Shouichi Okumura ,  Mikio Sato ,  Yoshiki Konishi ,  Morio Oba ,  Koji Sato ,  Junichi Harada ,  Shigeharu Ueyama ,  Koji Eguchi ,  Goro Takahashi

IPC分类号： G06F19/00

CPC分类号： G06F17/5095

摘要： A product design CAD data reconstruction unit 50 reconstructs product design CAD data used for product evaluation regarding an initial design so as to fulfill restrictive conditions obtained from the product evaluation based on a product structure for the initial design. The reconstructed product design CAD data is stored in a product design CAD data database 90. Upon reception of a corrected design obtained by correcting the initial design, the product design CAD data for the initial design is read from the product design CAAD data database 90, and the product design CAD data is corrected along a design surface of the corrected design.

摘要翻译： 产品设计CAD数据重建单元50重建用于关于初始设计的产品评估的产品设计CAD数据，以便实现基于初始设计的产品结构从产品评估获得的限制条件。 重建产品设计CAD数据存储在产品设计CAD数据数据库90中。 在接收到通过校正初始设计获得的校正设计后，从产品设计CAAD数据数据库90读取用于初始设计的产品设计CAD数据，并且沿着校正设计的设计表面校正产品设计CAD数据。

公开(公告)号：US4039961A

公开(公告)日：1977-08-02

申请号：US611545

申请日：1975-09-08

申请人： Hideki Ishio ,  Seizo Seki ,  Kazuhiro Miyauchi

发明人： Hideki Ishio ,  Seizo Seki ,  Kazuhiro Miyauchi

IPC分类号： H04L27/00 ,  H04L27/227 ,  H04L27/38 ,  H03D3/00 ,  H03D5/00 ,  H04L27/22

CPC分类号： H04L27/3836 ,  H04L27/2273 ,  H04L2027/0057 ,  H04L2027/0061

摘要： A digital carrier signal demodulation circuit is used in the carrier digital transmission system utilizing a 16-ary APK (Amplitude and Phase Keying) signal produced by the vector superposition of a second path signal consisting of a four-phase shift keying signal upon each phase of a first path signal consisting of a four-phase shift keying signal, the level of the second path signal being lower than that of the first path signal. The received 16-ary APK signal is detected with the reference carrier extracted from the received signal, regenerated to reproduce the base band pulses of the first path signal. The recovered base band pulses remodulate the reference carrier to produce the first path signal. The phases of the recovered first path signal and received signal are compared to phase lock a voltage controlled oscillator thereby producing the reference character.