摘要:
Systems and methods disclosed provide electrostatic discharge protection. For example, in accordance with an embodiment of the present invention, a circuit is disclosed having a diode string and a transistor in a cascode configuration that provides electrostatic discharge (ESD) protection and can operate in a mixed voltage environment.
摘要:
A system for protecting an integrated circuit (IC) from electrostatic discharge (ESD) events includes a sensing circuit that detects an occurrence of an ESD event on one of a plurality of power supply rails of the IC and, in response, outputs an alert signal identifying the occurrence of the ESD event. The system includes a driver circuit that, responsive to receiving the alert signal, outputs an enable signal, and a cascaded switch. The cascaded switch includes first and second gates disposed upon a channel located between a drain of the cascaded switch coupled to a first power supply rail and a source of the cascaded switch coupled to a second power supply rail. Each of the two gates receives the enable signal and, responsive to the enable signal, the cascaded switch closes to establish a coupling between the first power supply rail and the second power supply rail.
摘要:
An embedded inductor and a method for forming an inductor are described. Spaced apart first stripes are formed substantially parallel with respect to one another as part of a first metal layer. First contacts, second contacts, and third contacts in respective combination provide at least portions of posts. Spaced apart second stripes substantially parallel with respect to one another and to the first stripes are formed as part of a second metal layer located between the first metal layer and the second metal layer. The first stripes, the posts, and the second stripes in combination provide turns of a coil.
摘要:
Method and apparatus for compensating an integrated circuit design for mechanical stress effects. One aspect of the invention relates to designing an integrated circuit. Layout data is obtained that describes layers of the integrated circuit. At least one of the layers is analyzed to detect at least one structure susceptible to damage from mechanical stress. A bias is automatically added to each of the at least one structure to reduce mechanical stress of the at least one structure as fabricated. Augmented layout data is then provided for the integrated circuit.
摘要:
A diode is comprised of a doped region formed with a first dopant of a first conductivity type. In addition, the diode further comprises a substrate doped with a second dopant of a second conductivity type opposite of the first conductivity type. The lightly doped substrate, instead of a well, abuts the doped region for minimizing a junction capacitance of the diode. Such a diode is especially advantageous for ESD (electro-static discharge) protection of high speed integrated circuits.
摘要:
A high-voltage circuit protection device includes a p-n junction in a semiconductor substrate that is spaced apart from a first electrode region by a diode region. A semiconductor layer overlies the diode region and is separated therefrom by a dielectric layer. A shallow-doped region resides in the diode region spaced apart from the p-n junction by a predetermined distance. The predetermined distance preferably ranges from about 0 to about 50% of the length of the diode region. A process for fabricating the high-voltage device includes forming the shallow-doped region using a threshold adjustment mask followed by formation of the first electrode region using the semiconductor layer in a self-aligned doping process. The shallow-doped region functions to reduce the clamping voltage of the device.
摘要:
A junction diode includes a substrate having first and second cathode regions separated by an anode region. Metal silicide layers contact the first and second cathode regions and the anode regions. The anode region has a doping concentration sufficient to create a depletion region in the anode region adjacent to the metal silicide layer contacting the anode region. A fabrication process includes forming the anode region to have a doping concentration that increases in a direction into the anode region away from the substrate surface.
摘要:
Systems and methods provide electrostatic discharge simulation techniques. For example, a method in accordance with an embodiment of the present invention provides a simulation of electrostatic discharge in integrated circuits. The method may allow for the design of protection circuits and simulating electrostatic discharge events concurrently with the design of the associated electrical circuit.
摘要:
Systems and methods provide electrostatic discharge simulation techniques. For example, a method in accordance with an embodiment of the present invention provides a simulation of electrostatic discharge in integrated circuits. The method may allow for the design of protection circuits and simulating electrostatic discharge events concurrently with the design of the associated electrical circuit.