-
1.发明申请公开(公告)号：US20190079280A1
公开(公告)日：2019-03-14
申请号：US16185087
申请日：2018-11-09
Applicant: OLYMPUS CORPORATION
Inventor： Kazuhiro YOSHIDA , Takatoshi IGARASHI , Kazuya MAEDA
IPC: G02B23/24 , H04N5/225 , A61B1/05 , A61B1/00 , H01L27/146
Abstract: A manufacturing method of the optical unit for endoscope includes: a process of fabricating a bonded wafer by laminating a plurality of optical element wafers, each of the plurality of optical element wafers including a plurality of optical elements; a groove forming process of forming a groove on the bonded wafer along a cutting line for segmentation such that the groove has a bottom surface in the optical element wafer laminated at a lowermost part of the bonded wafer; and a cutting process of cutting the bonded wafer along the cutting line with a cutting margin narrower than a width of the groove and segmenting the bonded wafer, and the manufacturing method further includes a process of disposing a reinforcing member in the groove.
-
公开(公告)号：US20170311786A1
公开(公告)日：2017-11-02
申请号：US15652908
申请日：2017-07-18
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA , Shoichiro KAWAYOKE
CPC classification number: A61B1/051 , A61B1/0011 , A61B1/00114 , A61B1/00124 , A61B1/005 , A61B1/04 , H01L24/16 , H01L27/14 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L2224/16227 , H04N5/2256 , H04N2005/2255
Abstract: An image pickup apparatus includes an image pickup device configured such that a plurality of electrode pads are disposed in a row on an inclined surface; a wiring board configured such that a plurality of first bonded electrodes that are bonded to the plurality of electrode pads via first solder bumps, respectively, are disposed in a row on a first end portion, and a plurality of second bonded electrodes are disposed in a row on a second end portion; and a signal cable configured to be bonded to the plurality of second bonded electrodes via second solder bumps, respectively. The wiring board includes a first protective film which covers the first end portion, and a second protective film which covers the second end portion, and is of a thickness that is greater than a thickness of the first protective film and less than a height of the second solder bumps.
-
公开(公告)号：US20130234045A1
公开(公告)日：2013-09-12
申请号：US13869066
申请日：2013-04-24
Applicant: OLYMPUS CORPORATION , TERUMO KABUSHIKI KAISHA
Inventor： Kazuya MAEDA , Hiromasa KOHNO
IPC: G01N21/64
CPC classification number: G01N21/64 , G01N21/6428 , G01N21/6454 , G01N2201/1211
Abstract: A correction method of a fluorescence sensor includes a first detection signal acquiring step for acquiring, at a first temperature, a first detection signal using a fluorescence sensor having a temperature detecting function and a temperature adjusting function, a second detection signal acquiring step for acquiring, at a second temperature, a second detection signal when an analyte amount is the same as an analyte amount in the first detection signal acquiring step, a correction coefficient calculating step for calculating, on the basis of the first detection signal and the second detection signal, a correction coefficient for correcting the fluorescent light detection signal, and a correcting step for correcting subsequent detection signals using the correction coefficient and a temperature detection signal.
Abstract translation: 荧光传感器的校正方法包括：第一检测信号获取步骤，用于在第一温度下使用具有温度检测功能和温度调节功能的荧光传感器获取第一检测信号;第二检测信号获取步骤， 在第二温度下，当分析物量与第一检测信号获取步骤中的分析物量相同时的第二检测信号;校正系数计算步骤，用于根据第一检测信号和第二检测信号， 用于校正荧光检测信号的校正系数，以及校正步骤，用于使用校正系数和温度检测信号校正后续检测信号。
-
公开(公告)号：US20220404606A1
公开(公告)日：2022-12-22
申请号：US17899727
申请日：2022-08-31
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
Abstract: An optical unit includes a transparent first substrate, a transparent second substrate, a transparent first projection forming a part of an optical path, and a first aperture configured by black resin filled in a periphery of the first projection between the first substrate and the second substrate.
-
公开(公告)号：US20210255451A1
公开(公告)日：2021-08-19
申请号：US17238388
申请日：2021-04-23
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
IPC: G02B23/24
Abstract: An endoscope lens unit includes a first optical device which includes a first glass plate including a first side surface, a second optical device which includes a second glass plate including a second side surface having the same external dimension as an external dimension of the first side surface, a spacer which includes a third side surface and which defines a distance between the first glass plate and the second glass plate, and a light shielding resin which covers the first side surface, the second side surface, and the third side surface, at least part of the third side surface being located closer to an optical axis than the first side surface and the second side surface and constituting a bottom of a recess, the first glass plate and the second glass plate defining wall surfaces of the recess, the recess being filled with the light shielding resin.
-
Patent Agency Ranking
公开(公告)号：US20180249049A1
公开(公告)日：2018-08-30
申请号：US15969898
申请日：2018-05-03
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
IPC: H04N5/225
CPC classification number: H04N5/2253 , A61B1/00018 , A61B1/00114 , A61B1/00124 , A61B1/0052 , A61B1/0055 , A61B1/051 , H04N5/2257 , H04N2005/2255
Abstract: An endoscope includes: a distal end rigid portion in which an image pickup device is disposed; a bending portion for changing a direction of the distal end rigid portion; and a flexible portion extended from the bending portion, and further includes a flexible wiring board including deformation portions that deform due to bending deformation of the bending portion and non-deformation portions that do not deform due to the bending deformation of the bending portion, the deformation portions and non-deformation portions being alternately provided in a continuous manner, the wiring board including a plurality of wirings connected with the image pickup device.
-
公开(公告)号：US20210396975A1
公开(公告)日：2021-12-23
申请号：US17464169
申请日：2021-09-01
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
Abstract: A manufacturing method of an image pickup apparatus for endoscope includes: fabricating a first optical wafer and a second optical wafer including spacers; disposing walls made of a first resin, being greater in height than the spacers, and enclosing optical paths without any gap; clamping the first optical wafer and the second optical wafer with the walls being interposed between the first optical wafer and the second optical wafer; charging a second resin around the walls; performing curing treatment on the second resin to cause the second resin to shrink, and fix the first optical wafer and the second optical wafer in a state where an interval between the first optical wafer and the second optical wafer is defined by the spacers; and cutting a bonded wafer.
-
公开(公告)号：US20210063724A1
公开(公告)日：2021-03-04
申请号：US17008930
申请日：2020-09-01
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
IPC: G02B23/24 , H01L27/146 , A61B1/05 , A61B1/00
Abstract: An image pickup apparatus for endoscope includes: an image pickup unit having a light receiving surface and a back surface; and a lens unit having a front surface and a rear surface. The light receiving surface of the image pickup unit is disposed adjacently to the rear surface of the lens unit. An entire outer surface of the lens unit except the front surface and a region of the rear surface to which the light receiving surface is disposed adjacently is covered by a light blocking layer. An entire surface of the light blocking layer is covered by a protective layer having lower moisture vapor transmission than the light blocking layer.
-
9.发明申请公开(公告)号：US20190090720A1
公开(公告)日：2019-03-28
申请号：US16204575
申请日：2018-11-29
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
Abstract: A manufacturing method of an optical unit for endoscope includes: a process of fabricating a plurality of element wafers each including an optical element having an optical path portion and a spacer portion; a first adhesion process of fabricating a laminated wafer by adhering the element wafers with a first adhesive portion composed of a solid first adhesive disposed in a gap between the spacer portions; a second adhesion process of fabricating a bonded wafer by injecting a liquid second adhesive in the gap between the spacer portions; a curing process of performing curing treatment on the second adhesive; and a process of cutting the bonded wafer.
-
公开(公告)号：US20180040652A1
公开(公告)日：2018-02-08
申请号：US15783157
申请日：2017-10-13
Applicant: OLYMPUS CORPORATION
Inventor： Kazuya MAEDA
IPC: H01L27/146 , H04N5/225
CPC classification number: H01L27/14618 , H01L27/14683 , H04N5/2257
Abstract: An image pickup module includes: an image pickup device provided with a plurality of electrode pads lined up on an inclined surface inclined at an acute first angle to a light receiving surface; and a flexible wiring board provided with a plurality of bond electrodes each bonded with each of the plurality of electrode pads of the image pickup device and lined up in parallel to an end side, and the image pickup module further includes a holding portion that is a triangular angle regulating portion extended from a side face of the wiring board, an angle of which formed by a first side and a second side is the first angle, and a resin member fixing the image pickup device and the wiring board, a relative angle of which is regulated to the first angle by the holding portion.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.01 seconds)
