公开(公告)号：US20140125370A1

公开(公告)日：2014-05-08

申请号：US13787472

申请日：2013-03-06

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Shih-Duen Lin ,  Wen-Jen Ho ,  Chih-Pin Jen ,  Wei-Feng Lin ,  Yi-Chang Hsieh

IPC: G01R31/26 ,  G01R3/00 ,  G01R1/07

CPC classification number: G01R1/07364 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/311 ,  Y10T29/49165

Abstract: A probe card for use in testing a wafer and a method of making the probe card include a printed circuit board (PCB) formed with a conductor pattern and a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, and the probe head being made of an electrically insulating material. At least one conductive pogo pin is disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB. At least one conductive probe pin includes a cantilever portion and a tip portion. The cantilever portion is in contact with and electrically connected to a second end of the pogo pin, and the tip portion is electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB. The cantilever portion of the probe pin is fixedly attached to the probe head.

Abstract translation: 用于测试晶片的探针卡和制造探针卡的方法包括形成有导体图案的印刷电路板（PCB）和位于PCB附近的探针头，探针头限定至少一个通过 探针头，探针头由电绝缘材料制成。 至少一个导电弹簧针分别设置在至少一个孔中，弹簧销具有电连接到PCB上的导体图案的第一端。 至少一个导电探针包括悬臂部分和尖端部分。 悬臂部分与弹簧销的第二端接触并电连接，并且尖端部分可电连接到晶片以将晶片电连接到PCB上的导体图案。 探针的悬臂部分固定在探头上。

公开(公告)号：US09494617B2

公开(公告)日：2016-11-15

申请号：US13787472

申请日：2013-03-06

Applicant: OmniVision Technologies, Inc.

Inventor： Shih-Duen Lin ,  Wen-Jen Ho ,  Chih-Pin Jen ,  Wei-Feng Lin ,  Yi-Chang Hsieh

IPC: G01R1/073 ,  G01R1/00 ,  G01R3/00

CPC classification number: G01R1/07364 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/311 ,  Y10T29/49165

Abstract: A probe card for use in testing a wafer and a method of making the probe card include a printed circuit board (PCB) formed with a conductor pattern and a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, and the probe head being made of an electrically insulating material. At least one conductive pogo pin is disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB. At least one conductive probe pin includes a cantilever portion and a tip portion. The cantilever portion is in contact with and electrically connected to a second end of the pogo pin, and the tip portion is electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB. The cantilever portion of the probe pin is fixedly attached to the probe head.

Abstract translation: 用于测试晶片的探针卡和制造探针卡的方法包括形成有导体图案的印刷电路板（PCB）和位于PCB附近的探针头，探针头限定至少一个通过 探针头，探针头由电绝缘材料制成。 至少一个导电弹簧针分别设置在至少一个孔中，弹簧销具有电连接到PCB上的导体图案的第一端。 至少一个导电探针包括悬臂部分和尖端部分。 悬臂部分与弹簧销的第二端接触并电连接，并且尖端部分可电连接到晶片以将晶片电连接到PCB上的导体图案。 探针的悬臂部分固定在探头上。