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    Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture
    2.
    发明授权
    Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture 有权

    公开(公告)号：US11520197B2

    公开(公告)日：2022-12-06

    申请号：US16875953

    申请日：2020-05-15

    Applicant: OmniVision Technologies, Inc.

    Inventor： Chun-Sheng Fan ,  Wei-Feng Lin

    IPC: G02F1/1362

    Abstract: An active-pixel device assembly with stray-light reduction includes an active-pixel device including a semiconductor substrate and an array of active pixels, a light-transmissive substrate disposed on a light-receiving side of the active-pixel device, and a rough opaque coating disposed on a first surface of the light-transmissive substrate and forming an aperture aligned with the array of active pixels, wherein the rough opaque coating is rough so as to suppress reflection of light incident thereon from at least one side. A method for manufacturing a stray-light-reducing coating for an active-pixel device assembly includes depositing an opaque coating on a light-transmissive substrate such that the opaque coating forms a light-transmissive aperture, and roughening the opaque coating to form a rough opaque coating, said roughening including treating the opaque coating with an alkaline solution.

    IMAGE SENSOR PACKAGE
    4.
    发明申请
    IMAGE SENSOR PACKAGE 有权

    公开(公告)号：US20210193716A1

    公开(公告)日：2021-06-24

    申请号：US16725698

    申请日：2019-12-23

    Applicant: OMNIVISION TECHNOLOGIES, INC.

    Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

    IPC: H01L27/146

    Abstract: An image sensor package includes a transparent substrate with a recess formed in the transparent substrate, and an image sensor positioned in the recess so that light incident on the transparent substrate passes through the transparent substrate to the image sensor. The image sensor package also includes a circuit board electrically disposed in the recess and coupled to receive image data from the image sensor, and the image sensor is positioned in the recess between the circuit board and the transparent substrate.

    ANTI-REFLECTIVE COATING WITH HIGH REFRACTIVE INDEX MATERIAL AT AIR INTERFACE
    5.
    发明申请
    ANTI-REFLECTIVE COATING WITH HIGH REFRACTIVE INDEX MATERIAL AT AIR INTERFACE 审中-公开

    公开(公告)号：US20200335534A1

    公开(公告)日：2020-10-22

    申请号：US16816683

    申请日：2020-03-12

    Applicant: OmniVision Technologies, Inc.

    Inventor： Chun-Sheng Fan ,  Chen-Wei Tsai ,  Wei-Feng Lin

    IPC: H01L27/146

    Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.

    IMAGE SENSOR MODULE HAVING PROTECTIVE STRUCTURE
    6.
    发明申请
    IMAGE SENSOR MODULE HAVING PROTECTIVE STRUCTURE 审中-公开

    公开(公告)号：US20190027531A1

    公开(公告)日：2019-01-24

    申请号：US15654271

    申请日：2017-07-19

    Applicant: OmniVision Technologies, Inc.

    Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  Yu-Mei Su

    IPC: H01L27/146 ,  H04N1/03 ,  H04N5/225

    Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.

    Image sensor testing probe card
    10.
    发明授权
    Image sensor testing probe card 有权
    图像传感器测试探针卡

    公开(公告)号：US09494617B2

    公开(公告)日：2016-11-15

    申请号：US13787472

    申请日：2013-03-06

    Applicant: OmniVision Technologies, Inc.

    Inventor： Shih-Duen Lin ,  Wen-Jen Ho ,  Chih-Pin Jen ,  Wei-Feng Lin ,  Yi-Chang Hsieh

    IPC: G01R1/073 ,  G01R1/00 ,  G01R3/00

    CPC classification number: G01R1/07364 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/311 ,  Y10T29/49165

    Abstract: A probe card for use in testing a wafer and a method of making the probe card include a printed circuit board (PCB) formed with a conductor pattern and a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, and the probe head being made of an electrically insulating material. At least one conductive pogo pin is disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB. At least one conductive probe pin includes a cantilever portion and a tip portion. The cantilever portion is in contact with and electrically connected to a second end of the pogo pin, and the tip portion is electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB. The cantilever portion of the probe pin is fixedly attached to the probe head.

    Abstract translation: 用于测试晶片的探针卡和制造探针卡的方法包括形成有导体图案的印刷电路板（PCB）和位于PCB附近的探针头，探针头限定至少一个通过 探针头，探针头由电绝缘材料制成。 至少一个导电弹簧针分别设置在至少一个孔中，弹簧销具有电连接到PCB上的导体图案的第一端。 至少一个导电探针包括悬臂部分和尖端部分。 悬臂部分与弹簧销的第二端接触并电连接，并且尖端部分可电连接到晶片以将晶片电连接到PCB上的导体图案。 探针的悬臂部分固定在探头上。

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