公开(公告)号：US11222999B2

公开(公告)日：2022-01-11

申请号：US16649551

申请日：2018-09-21

Applicant: OSRAM OLED GmbH

Inventor： Reiner Windisch ,  Florian Bösl ,  Andreas Dobner ,  Matthias Sperl

IPC: H01L33/62 ,  H01L33/54

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

公开(公告)号：US10727384B2

公开(公告)日：2020-07-28

申请号：US16228588

申请日：2018-12-20

Applicant: OSRAM OLED GMBH

Inventor： Florian Bösl ,  Matthias Sabathil

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.