公开(公告)号：US11525554B2

公开(公告)日：2022-12-13

申请号：US16979605

申请日：2019-03-05

Applicant: OSRAM OLED GmbH

Inventor： Jasmin Muster ,  Dennis Sprenger ,  Joerg Sorg ,  Sergey Kudaev ,  Andreas Dobner ,  Melanie Zumkley

IPC: F21V9/30 ,  F21S41/176 ,  F21S41/16 ,  H01S5/0237 ,  H01S5/02345 ,  H01S5/02212 ,  H01S5/024 ,  H01S5/323 ,  H01S5/00

Abstract: An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

公开(公告)号：US11222999B2

公开(公告)日：2022-01-11

申请号：US16649551

申请日：2018-09-21

Applicant: OSRAM OLED GmbH

Inventor： Reiner Windisch ,  Florian Bösl ,  Andreas Dobner ,  Matthias Sperl

IPC: H01L33/62 ,  H01L33/54

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

公开(公告)号：US11329199B2

公开(公告)日：2022-05-10

申请号：US16762056

申请日：2019-01-24

Applicant: OSRAM OLED GmbH

Inventor： Britta Göötz ,  Matthias Hien ,  Andreas Dobner ,  Peter Brick ,  Matthias Goldbach ,  Uli Hiller ,  Sebastian Stigler

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.

公开(公告)号：US20200343419A1

公开(公告)日：2020-10-29

申请号：US16762056

申请日：2019-01-24

Applicant: OSRAM OLED GmbH

Inventor： Britta Göötz ,  Matthias Hien ,  Andreas Dobner ,  Peter Brick ,  Matthias Goldbach ,  Uli Hiller ,  Sebastian Stigler

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip, a method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence having an emission side, the emission side comprising a plurality of emission fields, partition walls on the emission side in a region between two adjacent emission fields and a conversion element on one or more emission fields, wherein the conversion element includes a matrix material with first phosphor particles incorporated therein, wherein the first phosphor particles are sedimented in the matrix material such that a mass fraction of the first phosphor particles is greater in a lower region of the conversion element facing the semiconductor layer sequence than in a remaining region of the conversion element, and wherein the partition walls are attached to the emission side without any additional connectors.

公开(公告)号：US11662070B2

公开(公告)日：2023-05-30

申请号：US17259064

申请日：2019-07-10

Applicant: OSRAM OLED GmbH

Inventor： Frank Singer ,  Ralph Bertram ,  Andreas Dobner ,  Andreas Waldschik

IPC: F21S4/20 ,  F21V9/30 ,  B29C48/154 ,  B29C48/06 ,  B29C48/30 ,  H01L25/075 ,  H01L33/54 ,  B29K83/00 ,  B29L11/00 ,  B29L31/34

CPC classification number: F21S4/20 ,  B29C48/06 ,  B29C48/154 ,  B29C48/304 ,  F21V9/30 ,  H01L25/0753 ,  H01L33/54 ,  B29K2083/00 ,  B29K2995/0035 ,  B29L2011/0075 ,  B29L2031/3462

Abstract: A placement device for placing optoelectronic components on electrical lines includes a holding device for holding at least one electric line extending in a longitudinal direction, and an application device for arranging optoelectronic components on the at least one electrical line.

公开(公告)号：US11316075B2

公开(公告)日：2022-04-26

申请号：US16754720

申请日：2018-10-08

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Christoph Koller ,  Andreas Dobner

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/62 ,  H01S5/02208 ,  H01S5/0237 ,  H01S5/02326 ,  H01S5/022 ,  H01S5/02315

Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.