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公开(公告)号：US20210126156A1
公开(公告)日：2021-04-29
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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公开(公告)号：US20210135068A1
公开(公告)日：2021-05-06
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/0232 , H01L31/18
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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公开(公告)号：US11211524B2
公开(公告)日：2021-12-28
申请号：US16631294
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.
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公开(公告)号：US11038090B2
公开(公告)日：2021-06-15
申请号：US16632613
申请日：2018-07-31
Applicant: OSRAM OLED GmbH
Inventor： Daniel Leisen , Herbert Brunner , Emilia Dinu , Jens Eberhard , Christina Keith , Markus Pindl , Thomas Reeswinkel , Daniel Richter , Christopher Wiesmann , Ludwig Peyker , Alexander Linkov
IPC: H01L33/54 , H01L33/50 , H01L33/56 , H01L31/0203 , H01L31/18 , H01L31/0232
Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
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