公开(公告)号：US20210135068A1

公开(公告)日：2021-05-06

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US11211524B2

公开(公告)日：2021-12-28

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L31/18 ,  H01L33/50 ,  H01L33/54

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

公开(公告)号：US20210043813A1

公开(公告)日：2021-02-11

申请号：US16964937

申请日：2019-01-18

Applicant: OSRAM OLED GmbH

Inventor： Thomas Reeswinkel ,  Kathy Schmidtke

IPC: H01L33/56 ,  H01L33/62

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes at least one optoelectronic semiconductor chip configured to emit radiation and an encapsulation around the semiconductor chip. The encapsulation is a polysiloxane. A barrier layer can be used for protection against harmful gases, the barrier layer being arranged on the encapsulation. The barrier layer is a plasma-polymerized siloxane layer.

公开(公告)号：US20210126156A1

公开(公告)日：2021-04-29

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

公开(公告)号：US20210083157A1

公开(公告)日：2021-03-18

申请号：US16978143

申请日：2019-03-20

Applicant: OSRAM OLED GmbH

Inventor： Rebecca Römer ,  Thomas Reeswinkel

IPC: H01L33/58 ,  H01L33/50

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment, an optoelectronic component includes a semiconductor chip configured to emit radiation and moisture-stable glass particles arranged in a beam path of the semiconductor chip, wherein the moisture-stable glass particles are filler, scattering particles and/or filter particles, wherein each of the moisture-stable glass particles comprises a moisture-sensitive core of a glass material, and wherein the core is covered with at least one moisture-stable inorganic coating.

公开(公告)号：US11038090B2

公开(公告)日：2021-06-15

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US10749084B2

公开(公告)日：2020-08-18

申请号：US16091321

申请日：2017-04-07

Applicant: OSRAM OLED GmbH

Inventor： Thomas Reeswinkel

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00 ,  H01L27/02 ,  H01L33/48 ,  H01L25/16

Abstract: An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.