公开(公告)号：US20210135068A1

公开(公告)日：2021-05-06

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US11870214B2

公开(公告)日：2024-01-09

申请号：US17971156

申请日：2022-10-21

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Harald König ,  Alfred Lell ,  Florian Peskoller ,  Karsten Auen ,  Roland Schulz ,  Herbert Brunner ,  Frank Singer ,  Roland Hüttinger

IPC: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/00

CPC classification number: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/0078 ,  H01S5/0087

Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 μm. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

公开(公告)号：US11735887B2

公开(公告)日：2023-08-22

申请号：US16754723

申请日：2018-10-08

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich Sorg ,  Harald König ,  Alfred Lell ,  Florian Peskoller ,  Karsten Auen ,  Roland Schulz ,  Herbert Brunner ,  Frank Singer ,  Roland Hüttinger

IPC: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/00

CPC classification number: H01S5/028 ,  H01S5/0236 ,  H01S5/02253 ,  H01S5/02326 ,  H01S5/0078 ,  H01S5/0087

Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 μm. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.

公开(公告)号：US11038090B2

公开(公告)日：2021-06-15

申请号：US16632613

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter ,  Christopher Wiesmann ,  Ludwig Peyker ,  Alexander Linkov

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/56 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.

公开(公告)号：US20210126156A1

公开(公告)日：2021-04-29

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L31/18

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.

公开(公告)号：US11211524B2

公开(公告)日：2021-12-28

申请号：US16631294

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Daniel Leisen ,  Herbert Brunner ,  Emilia Dinu ,  Jens Eberhard ,  Christina Keith ,  Markus Pindl ,  Thomas Reeswinkel ,  Daniel Richter

IPC: H01L33/00 ,  H01L31/18 ,  H01L33/50 ,  H01L33/54

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.