公开(公告)号：US11916166B2

公开(公告)日：2024-02-27

申请号：US17053805

申请日：2019-05-08

Applicant: Osram OLED GmbH

Inventor： Roland Heinrich Enzmann ,  Christian Mueller ,  Stefan Barthel ,  Vanessa Eichinger ,  Marc Christian Nenstiel ,  Lorenzo Zini

IPC: H01L33/14 ,  H01L25/16 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/14 ,  H01L25/167 ,  H01L33/005 ,  H01L33/382 ,  H01L33/62 ,  H01L33/642 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: An optoelectronic device may include an optoelectronic semiconductor chip that is configured to emit electromagnetic radiation. The chip may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and a plurality of electrical contact elements. The first current spreading layer may be arranged on a side of the second semiconductor layer facing away from the first semiconductor layer. The plurality of electrical contact elements may electrically connect the first semiconductor layer to the first current spreading layer. The second current spreading layer may be electrically connected to the second semiconductor layer. The second current spreading layer may be arranged between the first current spreading layer and the second semiconductor layer where an insulating layer insulates a first electrical contact element and a second electrical contact element from the second current spreading layer.

公开(公告)号：US11456404B2

公开(公告)日：2022-09-27

申请号：US16758401

申请日：2018-10-25

Applicant: OSRAM OLED GmbH

Inventor： Roland Heinrich Enzmann ,  Lorenzo Zini ,  Vanessa Eichinger ,  Stefan Barthel

IPC: H01L33/62 ,  H01L33/38

Abstract: An optoelectronic semiconductor chip may include a semiconductor body, a first and second contact element, a chip carrier, an electrically conductive contact layer, an electrically conductive supply layer, an insulating layer between the contact layer and the supply layer, and at least one electrically conductive feed-through element embedded in the insulating layer. The feed-through element(s) may electrically connect the supply layer to the contact layer. A quantity and/or size of the feed-through elements may be greater on a second side of the semiconductor body opposite to the first side than on the first side.