公开(公告)号：US20160005940A1

公开(公告)日：2016-01-07

申请号：US14766420

申请日：2014-01-23

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Walter WEGLEITER ,  Paola ALTIERI-WEIMAR ,  Juergen MOOSBURGER ,  Stefan STEGMEIER ,  Karl WEIDNER

IPC: H01L33/62 ,  H01L31/024 ,  H01L31/0203 ,  H01L33/64 ,  H01L33/48 ,  H01L31/02

CPC classification number: H01L33/62 ,  H01L24/18 ,  H01L24/24 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/024 ,  H01L33/483 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/15153

Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.

Abstract translation: 本发明涉及一种包括至少一个光电子半导体部件（2）和衬底（5）的器件（1），其上布置有半导体部件，其中绝缘层（4）邻近侧面（25 ）限制了半导体元件; 接触轨道（6）布置在半导体部件的辐射通道表面上并且以导电方式连接到半导体部件; 接触轨道延伸超过半导体部件的侧表面并且布置在绝缘层上; 并且相对于垂直于侧面发生的热机械负载释放接触轨迹。