公开(公告)号：US20220352126A1

公开(公告)日：2022-11-03

申请号：US17621060

申请日：2020-07-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas DOBNER ,  Hubert HALBRITTER

IPC: H01L25/075 ,  H01L25/16 ,  B60Q3/208 ,  B60J1/00 ,  B60Q1/24 ,  B32B17/10

Abstract: A light-emitting window element includes a transparent first carrier layer, a transparent second carrier layer, a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and an optical layer having an adjustable transparency. The substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layers, and the first and second carrier layers, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite.

公开(公告)号：US20220227230A1

公开(公告)日：2022-07-21

申请号：US17615396

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias GOLDBACH ,  Stefan GROETSCH ,  Ludwig HOFBAUER ,  Sebastian WITTMANN ,  Robert REGENSBURGER ,  Thomas SCHWARZ ,  Michael BRANDL ,  Andreas DOBNER ,  Sebastian STIGLER

IPC: B60K35/00 ,  H01L33/62 ,  H01B7/00 ,  H01B3/30 ,  H01B13/10

Abstract: An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.

公开(公告)号：US20220199873A1

公开(公告)日：2022-06-23

申请号：US17432407

申请日：2020-02-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias GOLDBACH ,  Andreas DOBNER

IPC: H01L33/62 ,  H01L31/02

Abstract: An optoelectronic component is specified, with an optoelectronic semiconductor chip which, in operation, is configured to emit or detect electromagnetic radiation, a connection carrier, on which the semiconductor chip is arranged, an electrically conductive connection, which is electrically conductively connected to the semiconductor chip and/or the connection carrier, and an electrically insulating material, which surrounds the semiconductor chip and/or the connection carrier at least in places, wherein the electrically conductive connection is arranged in places on the electrically insulating material. Furthermore, a method for producing an optoelectronic component is specified.

公开(公告)号：US20220352135A1

公开(公告)日：2022-11-03

申请号：US17762142

申请日：2020-10-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas DOBNER ,  Andreas WALDSCHIK ,  Matthias GOLDBACH

IPC: H01L25/16 ,  H01L33/62 ,  H01L23/495

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip with a main surface on which two electrical contacts are arranged. The optoelectronic component also includes a control chip for controlling the optoelectronic semiconductor chip with a plurality of electrical connection pads. The optoelectronic component further includes a housing with a housing body. The optoelectronic semiconductor chip is arranged with a mounting surface, which extends transversely to the main surface, in a first recess of the housing body. A side surface of the first recess forms an obtuse tilt angle with a bottom surface of the first recess. At least one of the electrical contacts of the optoelectronic semiconductor chip is electrically conductively connected to an electrical connection pad of the control chip via a conductor path. The conductor path is arranged at least in places on the side surface of the first recess.

公开(公告)号：US20220289028A1

公开(公告)日：2022-09-15

申请号：US17615738

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ludwig HOFBAUER ,  Armin WETTERER ,  Michael WITTMANN ,  Hanna SCHULZ ,  Sebastian WITTMANN ,  Andreas DOBNER ,  Ulrich FREI ,  Matthias GOLDBACH

IPC: B60K35/00

Abstract: An optoelectronic apparatus comprises a transparent first cover, at least layer two carriers mounted on the first cover, wherein a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and a second cover mounted on the at least two carriers, wherein the second cover has at least partially a lower optical transmittance than the first cover and/or the at least two carriers.

公开(公告)号：US20220238497A1

公开(公告)日：2022-07-28

申请号：US17615446

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas DOBNER ,  Matthias GOLDBACH ,  Sebastian WITTMANN ,  Uli HILLER ,  Markus KLEIN ,  Thomas SCHWARZ ,  Andreas WALDSCHIK ,  Michael WITTMANN ,  Matthias BRUCKSCHLOEGL ,  Stefan GROETSCH ,  Rainer HUBER ,  Peter BRICK ,  Ludwig HOFBAUER

IPC: H01L25/075 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

公开(公告)号：US20220244555A1

公开(公告)日：2022-08-04

申请号：US17615722

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas DOBNER ,  Uli HILLER ,  Peter BRICK ,  Hubert HALBRITTER ,  Thomas SCHWARZ ,  Michael WITTMANN ,  Stefan GROETSCH ,  Simon SCHWALENBERG ,  Sebastian WITTMANN

IPC: G02B27/12 ,  G02B1/04 ,  G02B5/26

Abstract: An optoelectronic device, in particular a display device, comprises: at least one optoelectronic light source, an at least partially transparent front layer, an at least partially transparent support layer, wherein the light source is arranged between the front layer and the support layer, wherein a front side of the light source faces the front layer and a rear side of the light source faces the support layer, and wherein a limiting device is provided in a circumferential direction around the light source, wherein the limiting device limits a spatial region, in which the light source emits light such that total internal reflection of the emitted light, in particular at an interface between the front layer and the outside, is avoided or at least reduced.

公开(公告)号：US20220020904A1

公开(公告)日：2022-01-20

申请号：US17414861

申请日：2019-12-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas SCHWARZ ,  Andreas DOBNER ,  Frank SINGER ,  Stefan GROETSCH

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L33/00

Abstract: An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.