公开(公告)号：US20220238497A1

公开(公告)日：2022-07-28

申请号：US17615446

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas DOBNER ,  Matthias GOLDBACH ,  Sebastian WITTMANN ,  Uli HILLER ,  Markus KLEIN ,  Thomas SCHWARZ ,  Andreas WALDSCHIK ,  Michael WITTMANN ,  Matthias BRUCKSCHLOEGL ,  Stefan GROETSCH ,  Rainer HUBER ,  Peter BRICK ,  Ludwig HOFBAUER

IPC: H01L25/075 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

公开(公告)号：US20160013369A1

公开(公告)日：2016-01-14

申请号：US14769699

申请日：2014-03-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Kathy SCHMIDTKE ,  Ion STOLL ,  Tony ALBRECHT ,  Markus KLEIN

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/502 ,  H01L33/005 ,  H01L33/44 ,  H01L33/483 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component, comprising: a carrier (1) and a semiconductor layer sequence (20) configured for emission of electromagnetic primary radiation and arranged on the carrier (10). The semiconductor layer sequence (20) comprises a radiation main side (21) facing away from the carrier. A connecting layer is applied directly at least on the radiation main side (21) of the semiconductor layer sequence. A conversion element (40) is configured for emission of electromagnetic secondary radiation and is arranged directly on connecting layer (30), and being formed as a prefabricated body. Connecting layer (30) comprises at least one inorganic filler (31) embedded in matrix material and being formed with a layer thickness of less than or equal to 2 μm. The prefabricated body is attached to the semiconductor layer sequence by the connecting layer which is configured in order to filter out a short-wave component of the electromagnetic primary radiation.

Abstract translation: 一种光电子部件，包括：载体（1）和被配置为发射电磁一次辐射并且布置在载体（10）上的半导体层序列（20）。 半导体层序列（20）包括背离载体的辐射主侧（21）。 至少在半导体层序列的辐射主侧（21）上直接施加连接层。 转换元件（40）被配置为发射电磁次级辐射，并且直接设置在连接层（30）上，并被形成为预制体。 连接层（30）包括嵌入基质材料中的至少一种无机填料（31），并形成层厚度小于或等于2μm。 预制体通过连接层附接到半导体层序列，该连接层被配置为滤除电磁一次辐射的短波分量。