摘要:
A display module includes a carrier with a front face and a rear face. The display module also includes a pixel array. The pixel array includes a plurality of electrically drivable pixels on the front face. In operation, electromagnetic radiation is emitted via each driven pixel. The display module further includes a wiring layer on the front face, via which the pixels are electrically connected to one another. The display module additionally includes a receiving unit on the front face. The receiving unit is electrically connected with the wiring layer. The receiving unit is configured to wirelessly receive a supply energy for the operation of the display module.
摘要:
The invention relates to a component with a support and a plurality of semiconductor chips, in which the support has a single-ply, electrically conducting support layer, wherein the support layer is structured and has a plurality of sublayers. The support layer has a mounting surface, on which the semiconductor chips are arranged, wherein the semiconductor chips are mechanically supported by the support layer and electrically conductively connected to the sublayers. The support has a common electrode for semiconductor chips of a group of a plurality of semiconductor chips, wherein the common electrode is formed by one of the sublayers or by a plurality of electrically connected sublayers of the support layer. The invention further relates to a method for producing a component of this kind.
摘要:
An optoelectronic light emitting device includes a plurality of programmable pixels arranged in a matrix of rows and columns, each pixel including at least one optoelectronic semiconductor component, and programming device configured to program the pixels in a plurality of successive time intervals. A row pattern including a subset of the rows of the matrix is given. The programming device is configured to program the pixels of those rows per time interval which are comprised by the row pattern. The row pattern is shifted by at least one row per time interval.
摘要:
The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
摘要:
Disclosed are various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
摘要:
A component comprising a structural element, a leadframe and a shaped body, in which component the structural element and the leadframe are enclosed at least in regions by the shaped body in lateral directions and the leadframe does not project beyond side faces of the shaped body. The leadframe has at least one first subregion and at least one second subregion which is laterally spaced apart from the first subregion, wherein the structural element is electrically conductively connected to the second subregion by a planar contact structure. Furthermore, the structural element is arranged, in plan view, on the first subregion and projects laterally beyond the first subregion at least in regions, so that the structural element and the first subregion form an anchoring structure at which the structural element and the first subregion are anchored to the shaped body. Further specified is a method for producing such a component.
摘要:
The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
摘要:
An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.
摘要:
The invention relates to a method for producing an electronic component with a carrier element (100), with the steps: producing the carrier element (100), having the steps A) providing a first metal layer (1) comprising a first metal material, wherein the first metal layer (1) has a first and a second main surface (10, 11) which face away from one another, B) applying a second metal layer (2) comprising a second metal material on at least one of the main surfaces (10, 11), C) converting a part of the second metal layer (2) into a dielectric ceramic layer (3), wherein the second metal material forms a component of the ceramic layer (3), and the ceramic layer (3) forms a surface (30) which faces away from the first metal layer (1) and is above the second metal layer (2);—arranging at least one electronic semiconductor chip (21) on the carrier element (100). The invention further relates to an electronic component with a carrier element (100).
摘要:
The invention relates to an optoelectronic semiconductor component comprising an optoelectronic semiconductor chip. In particular, the optoelectronic semiconductor component is a radiation-emitting semiconductor component which is designed as a side emitter. The invention also relates to a method for producing an optoelectronic semiconductor component of said type.