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41 条记录 (耗时 0.022 秒)

    MULTI-PIXEL DISPLAY DEVICE
    4.
    发明申请
    MULTI-PIXEL DISPLAY DEVICE 有权

    公开(公告)号：US20210384170A1

    公开(公告)日：2021-12-09

    申请号：US17289114

    申请日：2019-11-08

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Thomas SCHWARZ ,  Frank SINGER

    IPC分类号： H01L25/075 ,  H01L33/58 ,  H01L33/10 ,  H01L33/62

    摘要： A multi-pixel display device with an integrated circuit, a plurality of light-emitting semiconductor chips disposed on the integrated circuit, a display area having a plurality of pixels, each of the light-emitting semiconductor chips being associated with one of the pixels, a light-directing element disposed between the plurality of light-emitting semiconductor chips and the display area and adapted to direct the light of each light-emitting semiconductor chip from the plurality of light-emitting semiconductor chips to its associated pixel.

    SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
    7.
    发明申请
    SEMICONDUCTOR COMPONENT, LIGHTING DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT 有权
    半导体元件，照明器件及制造半导体元件的方法

    公开(公告)号：US20170077070A1

    公开(公告)日：2017-03-16

    申请号：US15310428

    申请日：2015-03-31

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Thomas SCHWARZ ,  Frank SINGER ,  Juergen MOOSBURGER ,  Georg BOGNER ,  Herbert BRUNNER ,  Matthias SABATHIL ,  Norwin VON MALM

    IPC分类号： H01L25/075 ,  H01L33/54 ,  H01L33/62

    CPC分类号： H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

    摘要： The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

    摘要翻译： 本发明涉及一种半导体部件（1），包括：多个半导体芯片（2），每个具有半导体层序列（200），具有用于产生辐射的有源区（20） 辐射输出侧（10），其平行于有源区域（20）延伸; 安装侧表面（11），其设置用于固定所述半导体部件，并且沿横向或垂直于所述辐射输出侧的方向延伸; 成形体（4），其形成在所述半导体芯片上的位置，并且至少部分地形成所述安装侧表面; 以及布置在成型体上并且以导电方式连接多个半导体芯片中的至少两个半导体芯片的接触结构（50）。 本发明还涉及一种照明装置（9）及其制造方法。

    COMPONENT AND METHOD FOR PRODUCING A COMPONENT
    8.
    发明申请
    COMPONENT AND METHOD FOR PRODUCING A COMPONENT 有权

    公开(公告)号：US20220376152A1

    公开(公告)日：2022-11-24

    申请号：US17626082

    申请日：2020-06-19

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Thomas SCHWARZ

    IPC分类号： H01L33/62 ,  H01L23/00 ,  H01L25/075

    摘要： A component comprising a structural element, a leadframe and a shaped body, in which component the structural element and the leadframe are enclosed at least in regions by the shaped body in lateral directions and the leadframe does not project beyond side faces of the shaped body. The leadframe has at least one first subregion and at least one second subregion which is laterally spaced apart from the first subregion, wherein the structural element is electrically conductively connected to the second subregion by a planar contact structure. Furthermore, the structural element is arranged, in plan view, on the first subregion and projects laterally beyond the first subregion at least in regions, so that the structural element and the first subregion form an anchoring structure at which the structural element and the first subregion are anchored to the shaped body. Further specified is a method for producing such a component.