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    Device and Connection Carrier
    1.
    发明申请
    Device and Connection Carrier 审中-公开

    公开(公告)号：US20190326496A1

    公开(公告)日：2019-10-24

    申请号：US16475064

    申请日：2017-12-29

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Stephan Haslbeck ,  Dirk Becker

    IPC: H01L33/62 ,  H01L25/16 ,  H01L31/0203 ,  H01L33/48

    Abstract: A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.

    Device and connection carrier
    3.
    发明授权
    Device and connection carrier 有权

    公开(公告)号：US10978628B2

    公开(公告)日：2021-04-13

    申请号：US16475064

    申请日：2017-12-29

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Stephan Haslbeck ,  Dirk Becker

    IPC: H01L33/62 ,  H01L25/16 ,  H01L31/0203 ,  H01L33/48

    Abstract: A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.

    Sensor device
    5.
    发明授权
    Sensor device 有权

    公开(公告)号：US11185243B2

    公开(公告)日：2021-11-30

    申请号：US16303719

    申请日：2017-05-23

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tim Böscke ,  Stephan Haslbeck

    IPC: A61B5/1455 ,  A61B5/024

    Abstract: A sensor device includes a first light emitter that emits light with a wavelength from a first spectral range, a second light emitter that emits light with a wavelength from a second spectral range, a first light detector configured to detect light with a wavelength from the first spectral range, but not to respond to light with a wavelength from the second spectral range, and a second light detector configured to detect light with a wavelength from the first spectral range and light with a wavelength from the second spectral range, wherein a distance between the first light emitter and the first light detector is smaller than a distance between the second light emitter and the second light detector.

    Optoelectronic Component and Assembly with such a Component
    6.
    发明申请
    Optoelectronic Component and Assembly with such a Component 审中-公开

    公开(公告)号：US20200212024A1

    公开(公告)日：2020-07-02

    申请号：US16608356

    申请日：2018-04-25

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Claus Jaeger ,  Stephan Haslbeck

    IPC: H01L25/16 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58

    Abstract: An optoelectronic component and an assembly with an optoectronic component are disclosed. In an embodiment an optoelectronic component includes an optical element with an outer surface and an inner surface that faces away from the outer surface, wherein the inner surface includes a first region of the optical element, in which the inner surface is flat, wherein the inner surface includes a second region of the optical element, wherein the second region adjoins the first region, and wherein the inner surface includes a third region of the optical element, in which the inner surface extends from the second region in the direction of a housing.

    SENSOR DEVICE
    7.
    发明申请
    SENSOR DEVICE 审中-公开

    公开(公告)号：US20190223738A1

    公开(公告)日：2019-07-25

    申请号：US16303719

    申请日：2017-05-23

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tim Böscke ,  Stephan Haslbeck

    IPC: A61B5/024 ,  A61B5/1455

    Abstract: A sensor device includes a first light emitter that emits light with a wavelength from a first spectral range, a second light emitter that emits light with a wavelength from a second spectral range, a first light detector configured to detect light with a wavelength from the first spectral range, but not to respond to light with a wavelength from the second spectral range, and a second light detector configured to detect light with a wavelength from the first spectral range and light with a wavelength from the second spectral range, wherein a distance between the first light emitter and the first light detector is smaller than a distance between the second light emitter and the second light detector.

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