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    Laser component and method of producing same
    1.
    发明授权
    Laser component and method of producing same 有权

    公开(公告)号：US10511138B2

    公开(公告)日：2019-12-17

    申请号：US15754333

    申请日：2016-08-23

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Wojcik ,  Martin Haushalter

    IPC: H01S5/022 ,  H01S3/02 ,  H01S5/00 ,  H01S5/024 ,  H01S5/40

    Abstract: A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.

    RADIATION-EMITTING COMPONENT
    3.
    发明申请
    RADIATION-EMITTING COMPONENT 有权
    辐射发射组件

    公开(公告)号：US20140307755A1

    公开(公告)日：2014-10-16

    申请号：US14352677

    申请日：2012-09-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Wojcik ,  Josip Maric ,  Martin Haushalter ,  Frank Möllmer

    IPC: H01S5/022

    CPC classification number: H01S5/02236 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02296 ,  H01S5/0428 ,  H01L2924/00

    Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least. in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.

    Abstract translation: 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 使用塑料，连接位置（1a，1b）至少在每种情况下延伸。 在沿壳体（3）的底面（3a）和侧面（3b）的位置处，所述侧面相对于底面横向延伸，并且该部件通过连接位置（1a）可表面安装 ，1b），使得底面（3a）或侧面（3b）形成部件的安装面。

    Reflector Trough for an Optoelectronic Semiconductor Component
    6.
    发明申请
    Reflector Trough for an Optoelectronic Semiconductor Component 有权
    光电半导体元件的反射槽

    公开(公告)号：US20150349222A1

    公开(公告)日：2015-12-03

    申请号：US14653835

    申请日：2013-12-16

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Wojcik ,  Martin Haushalter ,  Frank Möllmer ,  Wilhelm Karsten ,  Heinz Haas

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60

    CPC classification number: H01L33/62 ,  H01L23/49548 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L51/5203 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.

    Abstract translation: 光电子半导体元件包括具有两个引线框架部件的引线框架和光电子半导体芯片。 半导体芯片安装在第一引线框架部件上。 半导体部件的透光性灌封体将引线框架部件彼此机械连接。 灌封体设置用于波束整形。 第一引线框架部分具有反射槽，底座表面安装有半导体芯片。 反射槽具有三个横截面。 当在基面的平面图中看到时，这些部分围绕基部表面旋转并且在远离基部表面的方向上彼此相依。 在最接近基面的第一部分中，侧面垂直于基面定向。

    OPTOELECTRONIC COMPONENT
    8.
    发明申请
    OPTOELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180261731A1

    公开(公告)日：2018-09-13

    申请号：US15760027

    申请日：2016-09-15

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Wojcik ,  Martin Haushalter

    IPC: H01L33/48 ,  H01L33/62 ,  H01S5/022 ,  H01L33/52

    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip that emits electromagnetic radiation, arranged in a housing, wherein the housing has an outer wall face and an exit face transparent to the electromagnetic radiation, the exit face is set back relative to the outer wall face in a direction of an interior of the housing, the optoelectronic semiconductor chip is arranged such that radiation emitted by the optoelectronic semiconductor chip in an emission direction can emerge from the optoelectronic component through the exit face, and the outer wall face has separating marks and the exit face is free of separating marks.

    Radiation-emitting component
    10.
    发明授权
    Radiation-emitting component 有权
    辐射发射组件

    公开(公告)号：US09379517B2

    公开(公告)日：2016-06-28

    申请号：US14352677

    申请日：2012-09-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Andreas Wojcik ,  Josip Maric ,  Martin Haushalter ,  Frank Möllmer

    IPC: H01S3/00 ,  H01S5/022 ,  H01S5/042

    CPC classification number: H01S5/02236 ,  H01L2924/0002 ,  H01S5/02228 ,  H01S5/02244 ,  H01S5/02296 ,  H01S5/0428 ,  H01L2924/00

    Abstract: A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.

    Abstract translation: 具有金属载体主体（1）的辐射发射部件包括至少两个用于与部件电接触的连接位置（1a，1b），激光二极管芯片（2），固定到 金属载体主体（1），并且与至少两个连接位置（1a，1b）导电连接，壳体（3）在其中围绕金属载体主体（1）的位置形成，其中壳体（3）形成 连接位置（1a，1b）至少在沿壳体（3）的底面（3a）和侧面（3b）的位置上延伸，所述侧面相对于所述壳体 并且该部件可以通过连接位置（1a，1b）以表面（3a）或侧面（3b）形成该部件的安装面的方式表面安装。

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