公开(公告)号：US20160233200A1

公开(公告)日：2016-08-11

申请号：US15025759

申请日：2014-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Simon Jerebic ,  Tobias Geltl

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L21/66 ,  H01L33/54

Abstract: A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips.

Abstract translation: 公开了一种用于制造光电子部件的方法。 在各种实施例中，该方法包括在载体上布置多个光电子半导体芯片，并且通常在光电子半导体芯片的区域中压缩单独的模制化合物，其中在光电子半导体芯片的区域中形成分开的模制体。