公开(公告)号：US10157943B2

公开(公告)日：2018-12-18

申请号：US15004584

申请日：2016-01-22

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Chih-Hung Tu ,  Kuei-Cheng Liang ,  Chia-Yang Chang

IPC: H01L27/146 ,  H01L23/544

Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.

公开(公告)号：US20170213864A1

公开(公告)日：2017-07-27

申请号：US15004584

申请日：2016-01-22

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Chih-Hung Tu ,  Kuei-Cheng Liang ,  Chia-Yang Chang

IPC: H01L27/146 ,  H01L23/544

CPC classification number: H01L27/14618 ,  H01L23/544 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/11

Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.