公开(公告)号：US07105074B2

公开(公告)日：2006-09-12

申请号：US10202279

申请日：2002-07-22

申请人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

发明人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

IPC分类号： B05B3/00 ,  B08B3/00

CPC分类号： H01L21/6715 ,  H01L21/31133

摘要： A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.

公开(公告)号：US06832863B2

公开(公告)日：2004-12-21

申请号：US10458719

申请日：2003-06-09

申请人： Kenji Sugimoto ,  Minobu Matsunaga ,  Masakazu Sanada ,  Katsushi Yoshioka ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama

发明人： Kenji Sugimoto ,  Minobu Matsunaga ,  Masakazu Sanada ,  Katsushi Yoshioka ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama

IPC分类号： G03D500

CPC分类号： H01L21/67173 ,  G03F7/70691 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67276 ,  Y10S414/135 ,  Y10S414/14

摘要： A series of substrate transport paths for transporting substrates is arranged on upper and lower stories. Substrates are transferable between the substrate transport path on the first story and the substrate transport path on the second story. The paths include a going-only path for transporting the substrates forward, and a return-only path for transporting the substrates in the opposite direction, these paths being arranged on the upper and lower stories. An indexer connects one end of the substrate transport path on one story to one end of the substrate transport path on the other story. An interface connects the other end of the substrate transport path on one story to the other end of the substrate transport path on the other story. This construction efficiently reduces a waiting time due to interference between the substrates transported along the going-only path and the substrates transported along the return-only path.

摘要翻译： 用于传送基板的一系列基板传送路径被布置在上层和下层。 基底可以在第一层的基底输送路径和第二层的基底输送路径之间转移。 这些路径包括用于向前传送基板的唯一路径，以及用于沿相反方向传送基板的返回路径，这些路径布置在上部和下部故事物上。 分度器将另一个故事的基底传送路径的一端连接到基底传送路径的一端。 一个界面将一个故事的基板传送路径的另一端连接到另一个故事的基板传送路径的另一端。 这种构造有效地减少了由沿着仅路径传送的基板与沿着返回路径传送的基板之间的干涉导致的等待时间。

公开(公告)号：US06558053B2

公开(公告)日：2003-05-06

申请号：US10125229

申请日：2002-04-18

申请人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

发明人： Kazuhito Shigemori ,  Masakazu Sanada ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Tsuyoshi Mitsuhashi ,  Takashi Nagao ,  Mitsumasa Kodama ,  Yukihiko Inagaki ,  Yoshihisa Yamada

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67178

摘要： A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.