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1.发明授权
公开(公告)号：US4924506A
公开(公告)日：1990-05-08
申请号：US117704
申请日：1987-11-05
IPC分类号： G06T5/20
CPC分类号： G06T5/20
摘要： A method for directly measuring the area of a topological surface with an arbitrary boundary shape lying in a fixed elevation different from a fixed surrounding surface elevation relies upon binocular stereo vision. Three stereo correlation measurements are made, one over a window entirely within the surface of interest, a second over a window outside the surface of interest and within the surrounding area, and a third over a window fully containing the surface of interest as well as some of the surrounding area. The correlation measured in the third case is the linear sum of the correlation value over each of the first two cases weighted by the proportion of the window that the two surfaces occupy.
摘要翻译： 用于直接测量具有与固定的周围表面高度不同的固定高度的任意边界形状的拓扑表面的面积的方法依赖于双目立体视觉。 进行三次立体相关测量，一个窗口完全在感兴趣的表面内，一个位于感兴趣的表面外部和周围区域内的窗口上的第二个，以及完全包含感兴趣的表面的一个窗口上的第三个 的周边地区。 在第三种情况下测量的相关性是由两个表面占据的窗口的比例加权的前两个情况中的每一个之间的相关值的线性和。
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公开(公告)号：US5062567A
公开(公告)日：1991-11-05
申请号：US519334
申请日：1990-05-01
IPC分类号： H05K3/34
CPC分类号： H05K3/3426 , H05K2201/10689 , H05K2201/1084 , H05K2203/162 , Y02P70/613 , Y10T29/49149
摘要： An improved lead for surface-mounted electronic components is described. The improved lead includes an opening through the portion of the lead to be placed in contact with the printed circuit board for soldering. The opening, having a diameter approximately equal to the thickness of the lead, enables the detection of correctly-soldered joints using automated inspection equipment. When the lead is correctly soldered, solder is drawn by capillary action into the opening where it forms a meniscus. By automatically detecting the curvature of the meniscus, the quality of the solder joint may be determined.
摘要翻译： 描述了用于表面安装的电子部件的改进的引线。 改进的引线包括通过引线的与印刷电路板接触以供焊接的部分的开口。 具有大约等于引线厚度的直径的开口能够使用自动检测设备检测正确焊接的接头。 当引线正确焊接时，通过毛细管作用将焊料拉入到其中形成弯液面的开口中。 通过自动检测弯月面的曲率，可以确定焊点的质量。
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公开(公告)号：US4704342A
公开(公告)日：1987-11-03
申请号：US719020
申请日：1985-04-02
CPC分类号： G03F1/56 , G03F1/54 , Y10S430/146
摘要： A photomask for use in manufacturing integrated circuits is fabricated by coating a thin film of organic material, generally a solution of a thermally decomposable hydrocarbon, onto a glass plate and heating it in a reducing atmosphere to convert it into carbon. The carbon layer is masked and etched; for example, in an oxygen plasma, to produce the mask.
摘要翻译： 用于制造集成电路的光掩模通过将有机材料薄膜（通常为可热分解的烃的溶液）涂覆在玻璃板上并在还原气氛中加热以将其转化为碳来制造集成电路。 对碳层进行掩模蚀刻; 例如在氧等离子体中制造掩模。
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