公开(公告)号：US20200087474A1

公开(公告)日：2020-03-19

申请号：US16466979

申请日：2017-12-07

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Keiko KASHIHARA ,  Rihoko WATANABE ,  Hiroharu INOUE

IPC: C08J5/24 ,  C08K3/013 ,  H05K1/03 ,  H05K3/02

Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

公开(公告)号：US20210092835A1

公开(公告)日：2021-03-25

申请号：US16954020

申请日：2018-12-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Rihoko WATANABE ,  Keiko KASHIHARA ,  Hiroharu INOUE

IPC: H05K1/03 ,  H01L23/12 ,  H01L23/31 ,  H01L23/00

Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

公开(公告)号：US20190263087A1

公开(公告)日：2019-08-29

申请号：US16316579

申请日：2017-07-19

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Keiko KASHIHARA ,  Takashi HOSHI ,  Hiroharu INOUE

IPC: B32B5/02 ,  B32B15/14 ,  C08J5/24 ,  H05K1/03

Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).