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1.发明公开公开(公告)号：US20230331957A1
公开(公告)日：2023-10-19
申请号：US18025114
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08K5/3415 , C08J5/246 , C08J7/0427 , C08K3/36 , C08L53/00 , H05K1/0373 , C08J2353/00 , C08L2203/20
Abstract: A resin composition contains a maleimide compound (A) having an indane structure in the molecule, and a styrenic polymer being solid at 25° C.
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2.发明公开公开(公告)号：US20230250281A1
公开(公告)日：2023-08-10
申请号：US18012176
申请日：2021-06-14
Inventor： Jun YASUMOTO , Rihoko WATANABE , Teppei WASHIO , Hiroharu INOUE
CPC classification number: C08L79/08 , C08J5/246 , C08J7/0427 , H05K1/0353 , C08J2309/06 , C08J2333/08 , C08J2363/00 , C08J2379/08 , C08L2203/16 , C08L2205/035
Abstract: A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
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3.发明公开公开(公告)号：US20230331944A1
公开(公告)日：2023-10-19
申请号：US18025141
申请日：2021-09-09
Inventor： Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE , Rihoko WATANABE
IPC: C08J5/24 , C08F257/02 , C08F290/06 , C08K3/36 , H05K1/03
CPC classification number: C08J5/244 , C08F257/02 , C08F290/062 , C08K3/36 , C08J5/249 , H05K1/0346 , H05K1/0366 , C08J2351/06 , C08J2351/08
Abstract: A resin composition contains a maleimide compound (A) that has a maleimide equivalent of 500 g/eq. or less, is solid at 25° C., and dissolves at one or more concentration in a range of 40% by mass or more and less than 100% by mass as a concentration of the maleimide compound in a mixture of at least one selected from the group consisting of toluene and methyl ethyl ketone and the maleimide compound at 25° C.; and a polymerizable compound (B) having a carbon-carbon unsaturated double bond in a molecule and a proportion of a total mass of heteroatoms to a total mass of all constituent elements of 15% by mass or less.
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4.发明公开公开(公告)号：US20230323104A1
公开(公告)日：2023-10-12
申请号：US18025150
申请日：2021-09-09
Inventor： Rihoko WATANABE , Hirosuke SAITO , Hiroaki UMEHARA , Hiroharu INOUE
CPC classification number: C08L53/00 , C08K5/3415 , C08K3/36 , C08L2203/16 , C08J7/0427 , H05K1/0353 , C08J2325/06 , C08J5/246
Abstract: A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
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5.发明公开公开(公告)号：US20230250282A1
公开(公告)日：2023-08-10
申请号：US18012184
申请日：2021-06-14
Inventor： Rihoko WATANABE , Jun YASUMOTO , Hiroharu INOUE
IPC: C08L79/08 , C08K5/5313 , C08K5/5399 , C08J5/24 , C08J7/04 , H05K1/03
CPC classification number: C08L79/08 , C08K5/5313 , C08K5/5399 , C08J5/246 , C08J7/0427 , H05K1/0353 , C08L2205/03 , C08L2203/16 , C08J2309/06 , C08J2363/00 , C08J2379/08
Abstract: A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.
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Patent Agency Ranking
公开(公告)号：US20210054197A1
公开(公告)日：2021-02-25
申请号：US16977384
申请日：2019-03-11
Inventor： Hiroaki UMEHARA , Rihoko WATANABE , Hiroharu INOUE , Yiqun WANG
IPC: C08L71/12 , C08F112/08 , C08F120/14 , C08F222/40 , C08J5/24 , C08J5/04 , C08J5/18 , B32B15/08
Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).
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公开(公告)号：US20200087474A1
公开(公告)日：2020-03-19
申请号：US16466979
申请日：2017-12-07
Inventor： Keiko KASHIHARA , Rihoko WATANABE , Hiroharu INOUE
Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
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8.发明公开公开(公告)号：US20230257581A1
公开(公告)日：2023-08-17
申请号：US18012161
申请日：2021-06-14
Inventor： Jun YASUMOTO , Rihoko WATANABE , Teppei WASHIO , Hiroharu INOUE
CPC classification number: C08L79/085 , C08K5/521 , C08L25/08 , C08J5/24 , C08L2203/16 , C08L2203/20 , C08L2201/02
Abstract: A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure expressed by the following formula (b1), where s indicates an integer falling within a range from 1 to 10, Z indicates either an arylene group or an ester bond expressed by the following formula (b1.1), R1 to R3 each independently indicate either a hydrogen atom or a monovalent organic group, and * indicates a bond.
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9.发明申请公开(公告)号：US20210092835A1
公开(公告)日：2021-03-25
申请号：US16954020
申请日：2018-12-04
Inventor： Rihoko WATANABE , Keiko KASHIHARA , Hiroharu INOUE
Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.
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公开(公告)号：US20210032424A1
公开(公告)日：2021-02-04
申请号：US16978599
申请日：2019-03-11
Inventor： Hiroaki UMEHARA , Rihoko WATANABE , Hiroharu INOUE , Yiqun WANG
Abstract: A resin composition is provided and contains (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1) (in the formula, p represents an integer of 1 to 10), in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
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