SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号:US20150076500A1

    公开(公告)日:2015-03-19

    申请号:US14553559

    申请日:2014-11-25

    Abstract: Each imaging pixel provided in a solid-state imaging device includes a charge accumulation part which is a diffusion region formed in a substrate, a gate electrode formed lateral to the charge accumulation part on the substrate, an insulating film formed on the charge accumulation part, and a contact plug connected to the charge accumulation part so as to penetrate the insulating film and made of semiconductor. The contact plug is, at a lower part thereof, embedded in the insulating film, and is, at an upper part thereof, exposed through the insulating film. Silicide is formed on the upper part of the contact plug, and the charge accumulation part and the gate electrode are covered by the insulating film.

    Abstract translation: 提供在固态成像装置中的每个成像像素包括电荷累积部分,其是形成在衬底中的扩散区域,形成在衬底上的电荷累积部分侧面的栅电极,形成在电荷累积部分上的绝缘膜, 以及连接到电荷累积部分以便穿透绝缘膜并由半导体制成的接触插塞。 接触插塞在其下部嵌入绝缘膜,并且在其上部通过绝缘膜露出。 硅化物形成在接触插塞的上部,电荷累积部分和栅电极被绝缘膜覆盖。

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