公开(公告)号：US20210217544A1

公开(公告)日：2021-07-15

申请号：US16335600

申请日：2018-11-16

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Shogo NAKAYAMA

IPC分类号： H01C1/142 ,  H01C17/28

摘要： In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.

公开(公告)号：US20240274314A1

公开(公告)日：2024-08-15

申请号：US18570010

申请日：2022-06-16

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Shogo NAKAYAMA

IPC分类号： H01B5/14 ,  H05K1/18

CPC分类号： H01B5/14 ,  H05K1/181 ,  H05K2201/10363

摘要： A jumper chip component is designed to be mounted onto a printed board. The jumper chip component includes a base, a conductor, and an end face electrode. The base has electrical insulation properties. The conductor is disposed on a lower surface, facing the printed board, of the base to extend from a first end of the lower surface through a second end, facing the first end, of the lower surface. The end face electrode is disposed on at least a side surface of the base and arranged to be electrically connected to the conductor. The jumper chip component has one surface facing the printed board. The one surface is a flat surface.

公开(公告)号：US20240355512A1

公开(公告)日：2024-10-24

申请号：US18684148

申请日：2022-08-10

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Yuki AOIKE ,  Hirokatsu ITO ,  Kenichi MATSUSHIMA ,  Shogo NAKAYAMA ,  Tomohiro FUJITA ,  Takashi OHBAYASHI

IPC分类号： H01C7/06 ,  H01C17/00 ,  H01C17/065

CPC分类号： H01C7/06 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06546 ,  H01C17/06586

摘要： A resistive paste according to the present disclosure includes metal particles, insulating particles, glass particles, and a metal silicide. The metal particles include copper and nickel. The insulating particles include at least one of alumina, zirconia, zinc oxide, or boron nitride. A chip resistor according to the present disclosure includes a resistive element and a substrate. The resistive element includes the resistive paste as a material and is disposed on the substrate.

公开(公告)号：US20180211748A1

公开(公告)日：2018-07-26

申请号：US15935326

申请日：2018-03-26

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Seiji TSUDA ,  Shogo NAKAYAMA ,  Takeshi ISEKI ,  Kazutoshi MATSUMURA

IPC分类号： H01C1/14 ,  H01C17/28 ,  H01C17/24 ,  G03F7/40 ,  H01C17/06 ,  H01C17/00 ,  H01C7/00 ,  H01C17/065

CPC分类号： H01C1/14 ,  G03F7/40 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06 ,  H01C17/065 ,  H01C17/24 ,  H01C17/28 ,  H01C17/281

摘要： A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.