公开(公告)号：US09433103B2

公开(公告)日：2016-08-30

申请号：US14803185

申请日：2015-07-20

申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

发明人： Chia-Tin Chung ,  Chao-Chin Wu ,  Fang-Kuei Wu

IPC分类号： H05K3/28 ,  H01L33/54 ,  H01L33/60

CPC分类号： H05K3/285 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49146 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

摘要翻译： 一种制造多芯片封装结构的方法包括：提供衬底本体; 将多个发光芯片放置在基板主体上，其中发光芯片电连接到基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定的室温下自然地干燥周围的液体胶体的外层，以形成半干燥的周围的反光框架，其中半干燥的周围的光反射框架具有设置在基板主体上的非干燥的包围胶体，并且干燥的胶体 外层完全覆盖不干燥的周围胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半透明周围的光反射框架接触并包围封装胶体。