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20 条记录 (耗时 0.02 秒)

    Two-wire dimming lighting device
    1.
    发明授权
    Two-wire dimming lighting device 有权

    公开(公告)号：US11202357B2

    公开(公告)日：2021-12-14

    申请号：US16920792

    申请日：2020-07-06

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung ,  Pei-Chun Liu

    IPC分类号： H05B47/185 ,  H05B45/10 ,  H05B45/20 ,  H05B47/19

    摘要： A two-wire dimming lighting device includes an encoding circuit, a decoding circuit, a light source driving circuit, and an LED light emitting circuit. The encoding circuit wirelessly receives the dimming instruction, encodes an AC power according to the dimming instruction, and then outputs an encoded AC power. The decoding circuit receives the encoded AC power and then decodes the encoded AC power to obtain a light source driving instruction. The light source driving circuit receives the light source driving instruction and controls the changes of light emission of the LED light emitting circuit according to the light source driving instruction. The encoding circuit transmits the encoded AC power to the decoding circuit through a two-wire AC transmission wire.

    Illumination device
    2.
    发明授权
    Illumination device 有权

    公开(公告)号：US11333347B2

    公开(公告)日：2022-05-17

    申请号：US17145404

    申请日：2021-01-11

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung

    IPC分类号： F21V33/00 ,  F24F13/078 ,  A61L9/20 ,  F21Y115/10

    摘要： An illumination device includes a first light-emitting module, a second light-emitting module and an airflow-guiding structure. The second light-emitting module is adjacent to the first light-emitting module. The airflow-guiding structure includes a receiving casing, a first air inlet pipe in air communication with the receiving casing, and a first air outlet pipe in air communication with the receiving casing. The first light-emitting module is received inside the airflow-guiding structure. When external air flows into the receiving casing through the first air inlet pipe by natural convection, the external air inside the receiving casing is sterilized by a sterilization light source provided by the first light-emitting module, and the external air that has been sterilized by the sterilization light source flows out of the receiving casing through the first air outlet pipe by natural convection, and is then discharged out of the illumination device.

    Circuit substrate for carrying at least one light-emitting diode and light-emitting structure for providing illumination
    6.
    发明授权
    Circuit substrate for carrying at least one light-emitting diode and light-emitting structure for providing illumination 有权

    公开(公告)号：US09803846B2

    公开(公告)日：2017-10-31

    申请号：US14605388

    申请日：2015-01-26

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung

    IPC分类号： F21S4/00 ,  F21V29/50 ,  H05K1/02

    CPC分类号： F21V29/50 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/09027 ,  H05K2201/10106

    摘要： A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer. One of the first electrode conductive layer and the second electrode conductive layer is electrically connected to the conductive heat-dissipating layer through the conductive body.

    Illumination device
    7.
    发明授权
    Illumination device 有权
    照明装置

    公开(公告)号：US09544957B1

    公开(公告)日：2017-01-10

    申请号：US14957275

    申请日：2015-12-02

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung ,  Shih-Neng Tai

    IPC分类号： H05B33/08 ,  H05B37/02

    CPC分类号： H05B33/0815 ,  H05B33/0845 ,  H05B37/0227 ,  Y02B20/346

    摘要： An illumination device including a voltage transformer module, a switching unit, a control module, a sensor module, a first illumination module and a second illumination module. The switching unit is coupled to the rectifier module and the voltage transformer module. The control module is coupled to the switching unit and the voltage transformer module. The sensor module is electrically connected to the control module. The sensor module senses an invading object within an induction area. The first illumination module is electrically connected to the switching unit. The second illumination module is electrically connected to the sensor module. The sensor module supplies electricity to the second illumination module to emit light. The sensor module outputs a sensing signal to the control module when the sensor module senses the invading object. The control module controls the switching unit to be turned on so that the first illumination module emits light.

    摘要翻译： 一种照明装置，包括电压互感器模块，开关单元，控制模块，传感器模块，第一照明模块和第二照明模块。 开关单元耦合到整流器模块和电压互感器模块。 控制模块耦合到开关单元和电压互感器模块。 传感器模块电连接到控制模块。 传感器模块感应感应区域内的入侵物体。 第一照明模块电连接到开关单元。 第二照明模块电连接到传感器模块。 传感器模块向第二照明模块供电以发光。 当传感器模块感测入侵物体时，传感器模块向控制模块输出感测信号。 控制模块控制开关单元被接通，使得第一照明模块发光。

    LED illumination device
    8.
    发明授权
    LED illumination device 有权

    公开(公告)号：US11317493B2

    公开(公告)日：2022-04-26

    申请号：US16920498

    申请日：2020-07-03

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung ,  Pei-Chun Liu

    IPC分类号： H05B45/39 ,  H01L33/62 ,  H05B45/345 ,  F21V23/00

    摘要： An LED illumination device includes a circuit substrate, a bridge rectifier, a current-limiting chip, a resistance switching module and an LED group. The bridge rectifier is disposed on the circuit substrate and electrically connected to the circuit substrate. The current-limiting chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The resistance switching module is disposed on the circuit substrate and electrically connected to the circuit substrate. The LED group includes a plurality of LED chips disposed on the circuit substrate and electrically connected to the circuit substrate. The bridge rectifier, the current-limiting chip, the resistance switching module and the LED group are electrically connected with each other. The resistance switching module includes a plurality of resistance switches and a plurality of resistor elements respectively corresponding to the resistance switches, and each of the resistance switches includes a physical switching key that is exposed.

    METHOD OF MANUFACTURING A MULTICHIP PACKAGE STRUCTURE
    10.
    发明申请
    METHOD OF MANUFACTURING A MULTICHIP PACKAGE STRUCTURE 有权
    制造多媒体包装结构的方法

    公开(公告)号：US20150340352A1

    公开(公告)日：2015-11-26

    申请号：US14815918

    申请日：2015-07-31

    申请人： PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD.

    发明人： Chia-Tin Chung ,  Fang-Kuei Wu

    IPC分类号： H01L25/00 ,  H01L25/075 ,  H01L33/60

    CPC分类号： H01L25/50 ,  F21K9/68 ,  F21V31/04 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L23/24 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.

    摘要翻译： 一种制造多芯片封装结构的方法包括：提供基板主体; 将多个发光芯片放置在所述基板主体上，所述发光芯片电连接到所述基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定的室温下自然地干燥周围的液体胶体的外层，以形成半干燥的周围的反光框架，半干燥的周围的光反射框架具有设置在基体上的非干燥的包围胶体，以及干燥的周围的胶体 身体完全覆盖不干燥的周围胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半干燥周围的光反射框架接触并包围封装胶体。