公开(公告)号：US20210091238A1

公开(公告)日：2021-03-25

申请号：US17113349

申请日：2020-12-07

Applicant: PIXART IMAGING INC.

Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US20230020236A1

公开(公告)日：2023-01-19

申请号：US17955854

申请日：2022-09-29

Applicant: PIXART IMAGING INC.

Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

公开(公告)号：US20180122960A1

公开(公告)日：2018-05-03

申请号：US15607393

申请日：2017-05-26

Applicant: PIXART IMAGING INC.

Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236

CPC classification number: H01L31/0203 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02164 ,  H01L31/02363 ,  H01L31/024 ,  H01L31/095

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US20180269337A1

公开(公告)日：2018-09-20

申请号：US15979708

申请日：2018-05-15

Applicant: PIXART IMAGING INC.

Inventor： YI-CHANG CHANG ,  YEN-HSIN CHEN ,  CHI-CHIH SHEN

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/024 ,  H01L31/09 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  G01J5/00 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US20170062628A1

公开(公告)日：2017-03-02

申请号：US15096601

申请日：2016-04-12

Applicant: PIXART IMAGING INC.

Inventor： CHI-CHIH SHEN ,  YEN-HSIN CHEN ,  YI-CHANG CHANG

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/18 ,  H01L31/14

CPC classification number: H01L31/0203 ,  H01L31/02005 ,  H01L31/143 ,  H01L31/18 ,  H01L31/1876 ,  H01L2224/48091 ,  H01L2924/10155 ,  H01L2924/00014

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.

Abstract translation: 提供一种传感器芯片封装结构及其制造方法。 传感器芯片封装结构包括基板，传感器芯片和布线层。 传感器芯片安装在基板上，具有从上表面凹下的顶面和凹部。 传感器芯片具有形成在顶表面上的有源区，凹部位于有源区的一侧。 凹部的深度为100μm〜400μm。 布线层设置在传感器芯片上并电连接到有源区。 布线层的至少一部分从活性区域沿着凹部的侧壁延伸到凹部的底面。