公开(公告)号：US20240258451A1

公开(公告)日：2024-08-01

申请号：US18635010

申请日：2024-04-15

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih SHEN ,  Kuo-Hsiung LI ,  Shang-Feng HSIEH ,  Jui-Cheng CHUANG ,  Yi-Chang CHANG

IPC: H01L31/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/143 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/186

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

公开(公告)号：US12021109B2

公开(公告)日：2024-06-25

申请号：US18300928

申请日：2023-04-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masashi Murakami ,  Kazuko Nishimura ,  Yasuo Miyake ,  Yasunori Inoue

IPC: H01L27/146 ,  H01L27/142 ,  H01L31/14 ,  H10K39/32 ,  H04N25/571 ,  H04N25/76 ,  H04N25/77 ,  H10K30/80 ,  H10K50/80

CPC classification number: H01L27/14665 ,  H01L27/142 ,  H01L27/14601 ,  H01L27/14609 ,  H01L27/1461 ,  H01L31/143 ,  H10K39/32 ,  H04N25/571 ,  H04N25/76 ,  H04N25/77 ,  H10K30/80 ,  H10K50/80

Abstract: A camera system including a photoelectric convertor including a first and second electrode, and a photoelectric conversion layer; and a correction circuit correcting a signal corresponding to a potential change of the second electrode. The photoelectric convertor has a photoelectric conversion characteristic in which rate of change of the photoelectric conversion efficiency with respect to a first bias voltage between the first electrode and the second electrode when the first bias voltage is in a first voltage range, is greater than the rate of change with respect to a second bias voltage when the second bias voltage is in a second voltage range that is higher than the first voltage range, and a bias voltage between the first electrode and the second electrode exists in the first voltage range, and the correction circuit corrects the signal so that variation of an output regarding an amount of incident light becomes linear.

公开(公告)号：US11990557B2

公开(公告)日：2024-05-21

申请号：US17083763

申请日：2020-10-29

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Kuo-Hsiung Li ,  Shang-Feng Hsieh ,  Jui-Cheng Chuang ,  Yi-Chang Chang

IPC: H01L31/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/143 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/186

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

公开(公告)号：US20230253424A1

公开(公告)日：2023-08-10

申请号：US18300928

申请日：2023-04-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masashi MURAKAMI ,  Kazuko NISHIMURA ,  Yasuo MIYAKE ,  Yasunori INOUE

IPC: H01L27/146 ,  H01L27/142 ,  H01L31/14 ,  H10K39/32

CPC classification number: H01L27/1461 ,  H01L27/142 ,  H01L31/143 ,  H01L27/14665 ,  H01L27/14601 ,  H01L27/14609 ,  H10K39/32 ,  H04N25/76

Abstract: A camera system including a photoelectric convertor including a first and second electrode, and a photoelectric conversion layer; and a correction circuit correcting a signal corresponding to a potential change of the second electrode. The photoelectric convertor has a photoelectric conversion characteristic in which rate of change of the photoelectric conversion efficiency with respect to a first bias voltage between the first electrode and the second electrode when the first bias voltage is in a first voltage range, is greater than the rate of change with respect to a second bias voltage when the second bias voltage is in a second voltage range that is higher than the first voltage range, and a bias voltage between the first electrode and the second electrode exists in the first voltage range, and the correction circuit corrects the signal so that variation of an output regarding an amount of incident light becomes linear.

公开(公告)号：US08653484B2

公开(公告)日：2014-02-18

申请号：US13934899

申请日：2013-07-03

Applicant: Atlas Material Testing Technology GmbH

Inventor： Bernd Rudolph ,  Peter March

IPC: A61N5/00 ,  G21G5/00

CPC classification number: B01J19/123 ,  G01N17/004 ,  H01L31/143

Abstract: A UV light emitting diode (UV-LED) is arranged in a weathering chamber and a UV light receiving diode, which is constructed on the same material basis as the UV LED, is arranged relative to the UV LED in such a way that a portion of the radiation emitted by the UV LED impinges on the UV light receiving diode during the operation of the device.

Abstract translation: 紫外线发光二极管（UV-LED）布置在风化室中，并且以与UV LED相同的材料为基础构造的UV光接收二极管相对于UV LED布置成使得部分 由UV LED发射的辐射在器件的操作期间照射在UV光接收二极管上。

公开(公告)号：US4978208A

公开(公告)日：1990-12-18

申请号：US383698

申请日：1989-07-24

Applicant: Tsung-Yuan Hsu ,  Shin-Tson Wu ,  Robert Y. Loo

Inventor： Tsung-Yuan Hsu ,  Shin-Tson Wu ,  Robert Y. Loo

IPC: A61F9/02 ,  H01L31/14 ,  H01L31/153

CPC classification number: A61F9/023 ,  H01L31/143 ,  H01L31/153

Abstract: A spatial light modulator includes a photosensor diode and a photoemitting diode array, each having two semiconductive layers of opposite electrical polarities, and which are sandwiched together with layers of the same polarity (P or N) in electrical contact with each other. Transparent electrode layers are formed on the opposite surfaces of the photosensor diode and photoemitting diode array respectively, in electrical contact with the layers of the opposite polarity. The individual photoemitting diodes are electrically and optically isolated from each other. With a voltage applied across the electrodes which causes the photosensor diode to be reverse biased and the photoemitting diodes to be forward biased, the photoemitting diode array generates a visual display which is a reproduction of a light image incident on the photosensor diode. The photosensor diode may be replaced by a single layer of a photoconductive material. Two of the spatial light modulators may be combined in a frame with suitable optics to provide eye protection goggles.

Abstract translation: 空间光调制器包括光电二极管和光电二极管阵列，每个具有两个具有相反电极性的半导体层，并且它们被彼此电接触的具有相同极性（P或N）的层夹在一起。 透明电极层分别形成在光电二极管和发光二极管阵列的相对表面上，与相反极性的层电接触。 各个发光二极管彼此电隔离和光学隔离。 利用施加在电极两端的电压，使得光电传感器二极管被反向偏置并且光发光二极管被正向偏置，光发光二极管阵列产生视觉显示，其是入射在光电二极管上的光图像的再现。 光传感器二极管可以由单层感光材料代替。 两个空间光调制器可以在框架中与合适的光学器件组合以提供眼睛保护护目镜。

公开(公告)号：US11843086B2

公开(公告)日：2023-12-12

申请号：US17742705

申请日：2022-05-12

Applicant: PlayNitride Display Co., Ltd.

Inventor： Shiang-Ning Yang ,  Chih-Ling Wu ,  Yi-Min Su ,  Bo-Wei Wu

IPC: H01L25/075 ,  H01L31/16 ,  H01L31/14 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L31/143 ,  H01L31/162

Abstract: A semiconductor structure includes a substrate, a plurality of micro semiconductor devices and a fixing structure. The micro semiconductor devices are disposed on the substrate. The fixing structure is disposed between the substrate and the micro semiconductor devices. The fixing structure includes a plurality of conductive layers and a plurality of supporting layers. The conductive layers are disposed on the lower surfaces of the micro semiconductor devices. The supporting layers are connected to the conductive layers and the substrate. The material of each of the conductive layers is different from the material of each of the supporting layers.

公开(公告)号：US20230253519A1

公开(公告)日：2023-08-10

申请号：US18136633

申请日：2023-04-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Nicolas MASTROMAURO

IPC: H01L31/14 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/52

CPC classification number: H01L31/143 ,  G01S7/484 ,  G01S7/4865 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005 ,  H01L33/52 ,  H01L2933/005

Abstract: A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.

公开(公告)号：US20180114875A1

公开(公告)日：2018-04-26

申请号：US15789181

申请日：2017-10-20

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORP.

Inventor： TSAN-YU HO ,  CHEN-HSIU LIN ,  MENG-SUNG CHOU

IPC: H01L31/14 ,  H01L31/024 ,  H01L31/02

CPC classification number: H01L31/143 ,  H01L31/02005 ,  H01L31/024 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An optical sensor module has a light receiver and a light-emitter which is surrounded by a light blocking wall, wherein the light receiver is disposed on a main plate and the light-emitter is disposed on a side plate separately from the main plate. The light blocking wall is formed as a light barrier wall between the light receiver and the light-emitter. A projecting portion projecting upward from the main plate is enclosed by the light barrier wall, and a top face of the projecting portion is higher than the light receiving face and the light-emitting face.

公开(公告)号：US09741875B2

公开(公告)日：2017-08-22

申请号：US15096601

申请日：2016-04-12

Applicant: PIXART IMAGING INC.

Inventor： Chi-Chih Shen ,  Yen-Hsin Chen ,  Yi-Chang Chang

IPC: H01L23/02 ,  H01L31/0203 ,  H01L31/14 ,  H01L31/02 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L31/02005 ,  H01L31/143 ,  H01L31/18 ,  H01L31/1876 ,  H01L2224/48091 ,  H01L2924/10155 ,  H01L2924/00014

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.