公开(公告)号：US20160380167A1

公开(公告)日：2016-12-29

申请号：US14753847

申请日：2015-06-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Woon JEON ,  Kyong Su YOO

IPC: H01L33/58 ,  H05K1/18 ,  H05K1/02 ,  H01L33/48 ,  H01L33/62

CPC classification number: H05K1/182 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/97

Abstract: Disclosed are an uncut chip plate and a chip substrate. The uncut chip plate includes: conductive portions laminated in one direction to constitute the uncut chip plate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; and cavities formed at a predetermined depth in a hemispherical concave shape in regions including each of the insulation portions in a corresponding relationship with unit chip substrates defined on an upper surface of the uncut chip plate. According to the present invention, an optical element chip package exhibiting a high illuminance in a central portion can be realized through the use of an easy-to-process planar lens. Furthermore, as compared with a case where a hemispherical lens is used, it is possible to reduce the thickness of the chip package. This makes it possible to reduce the thickness of a device to which the chip package is applied.

Abstract translation: 公开了未切割的芯片板和芯片基板。 未切割的芯片板包括：在一个方向上层叠以构成未切割的芯片板的导电部分; 绝缘部分与导电部分交替地层叠以电绝缘导电部分; 以及在与所述未切割的芯片板的上表面上限定的单位芯片基板对应的关系中，包括每个所述绝缘部分的区域以预定深度形成半球形凹形的空腔。 根据本发明，可以通过使用易于处理的平面透镜来实现在中心部分中呈现高照度的光学元件芯片封装。 此外，与使用半球形透镜的情况相比，可以减小芯片封装的厚度。 这使得可以减小应用芯片封装的器件的厚度。