公开(公告)号：US11815668B2

公开(公告)日：2023-11-14

申请号：US17824823

申请日：2022-05-25

Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE

Inventor： Robert C. Devlin ,  Mohammadreza Khorasaninejad ,  Federico Capasso ,  Hongkun Park ,  Alexander Arthur High

IPC: G02B1/00 ,  G02B1/02 ,  G02B13/14 ,  H01L31/02 ,  G03F7/00 ,  G03F7/40 ,  C23C16/56 ,  C23C16/455 ,  C23C16/04

CPC classification number: G02B13/14 ,  C23C16/042 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  G02B1/002 ,  G02B1/005 ,  G03F7/0005 ,  G03F7/40 ,  H01L31/02 ,  G02B1/02

Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.

公开(公告)号：US11366296B2

公开(公告)日：2022-06-21

申请号：US15778208

申请日：2016-11-23

Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE

Inventor： Robert C. Devlin ,  Mohammadreza Khorasaninejad ,  Federico Capasso ,  Hongkun Park ,  Alexander Arthur High

IPC: G02B1/02 ,  G02B13/14 ,  G02B1/00 ,  H01L31/02 ,  G03F7/00 ,  G03F7/40 ,  C23C16/56 ,  C23C16/455 ,  C23C16/04

Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.