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公开(公告)号：US20190252795A1
公开(公告)日：2019-08-15
申请号：US16270940
申请日：2019-02-08
发明人： TOMOHIRO MURATA , JUNJI SATO
摘要： An antenna device includes: a first sub-array antenna provided on a substrate and having a group of first antenna elements, one or more third antenna elements, and a first electrical power line through which electric power is supplied to the group of first antenna elements and the one or more third antenna elements; and a second sub-array antenna provided on the substrate and having a group of second antenna elements, the one or more third antenna elements, and a second electrical power line through which electric power is supplied to the group of second antenna elements and the one or more third antenna elements. The one or more third antenna elements are placed away from the first electrical power line and the second electrical power line.
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公开(公告)号：US20180254550A1
公开(公告)日：2018-09-06
申请号：US15899678
申请日：2018-02-20
发明人： TOMOHIRO MURATA , JUNJI SATO
摘要： An antenna device includes: a dielectric substrate having a first surface and a second surface; a semiconductor substrate disposed above the first surface of the dielectric substrate and having a third surface and a fourth surface that faces the dielectric substrate; an integrated circuit disposed on the fourth surface of the semiconductor substrate; a radiator disposed on the fourth surface of the semiconductor substrate; a reflector disposed at a position where projection of the radiator along a radiation direction of an electromagnetic wave radiated from the radiator falls on the third surface of the semiconductor substrate; and one or more directors disposed at a position where projection of the radiator along the radiation direction falls on the dielectric substrate.
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公开(公告)号：US20170250457A1
公开(公告)日：2017-08-31
申请号：US15435157
申请日：2017-02-16
发明人： TOMOHIRO MURATA , JUNJI SATO
CPC分类号： H01Q1/2283 , H01Q1/48 , H01Q9/065 , H01Q21/00 , H01Q21/28
摘要： An antenna substrate, provided with: a substrate, a ground electrode, a first antenna element, a second antenna element, a first transmission line and a second transmission line. The first antenna element that is arranged at a first distance away from the ground electrode, on the substrate within the first opening area. The second antenna element that is arranged at a second distance away from the ground electrode, on the substrate within the second opening area. The first distance is a shortest distance between the ground electrode and the first antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the first antenna element vibrates. The second distance is a shortest distance between the ground electrode and the second antenna element in a direction along a plane along which an electric field among an electromagnetic wave radiated from the second antenna element vibrates. The first distance is different from the second distance.
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公开(公告)号：US20180277946A1
公开(公告)日：2018-09-27
申请号：US15926630
申请日：2018-03-20
发明人： TOMOHIRO MURATA , JUNJI SATO
IPC分类号： H01Q1/52 , H01Q19/185 , H01Q1/48
CPC分类号： H01Q1/521 , H01Q1/38 , H01Q1/48 , H01Q9/0407 , H01Q15/008 , H01Q19/185
摘要： An antenna apparatus includes: a dielectric substrate; at least first and second radiators disposed in a first wiring layer in the dielectric substrate; a first reflector disposed in a first range in a second wiring layer in the dielectric substrate, the first range including a second range where the first radiator is projected in the layer thickness direction of the dielectric substrate; a second reflector disposed in a third range in the second wiring layer, the third range including a fourth range where the second radiator is projected in the layer thickness direction; and an electromagnetic band-gap disposed between the first and second radiators. The electromagnetic band-gap has patches disposed in the first wiring layer, a ground electrode disposed in a third wiring layer at a different place from the second wiring layer in the layer thickness direction, and a first via extending in the layer thickness direction, both ends of the via mutually connecting the patches and ground electrode.
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公开(公告)号：US20150303541A1
公开(公告)日：2015-10-22
申请号：US14679844
申请日：2015-04-06
发明人： TOMOHIRO MURATA , TAKESHI FUKUDA
IPC分类号： H01P1/04
摘要： A board connection structure includes an opening, which is formed at an edge of a waveguide in a first board, and an opening, which is formed at an edge of a waveguide in a second board. The openings are connected to each other. The first board and the second board are connected with an insulation film disposed therebetween. The insulation film has a thickness of 60% or less of a waveguide width that determines a propagation mode in at least one of the waveguide in the first board and the waveguide in the second board.
摘要翻译： 板连接结构包括形成在第一板中的波导的边缘处的开口和形成在第二板中的波导的边缘处的开口。 开口彼此连接。 第一板和第二板与设置在其间的绝缘膜连接。 绝缘膜具有波导宽度的60％以下的厚度，该厚度决定了第一基板中的波导和第二基板中的波导中的至少一个的传播模式。
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