公开(公告)号：US20180145020A1

公开(公告)日：2018-05-24

申请号：US15580457

申请日：2016-07-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHINICHI KOHDA ,  JUNICHI KIMURA ,  RYOSUKE USUI ,  TOMOHIDE OGURA ,  ATSUSHI WATANABE

IPC: H01L23/50 ,  H01L23/58 ,  H01L23/36 ,  H01L23/495

CPC classification number: H01L23/50 ,  H01L23/36 ,  H01L23/48 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/585 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H05K7/20 ,  H01L2924/00014

Abstract: This semiconductor device includes a semiconductor element mounted on a metal layer, first to third connection terminals that are provided on the semiconductor element, a first bus bar bonded to the first connection terminal, and a second bus bar bonded to the second connection terminal. The semiconductor element is bonded to the metal layer, and the first to third connection terminals are disposed on a top surface of the semiconductor element. One end of the first bus bar is bonded to the first connection terminal, another end of the first bus bar is an output unit, one end of the second bus bar is bonded to the second connection terminal, and another end of the second bus bar is bonded to the metal layer. A first surface of the semiconductor element and the second bus bar are at an identical potential.

公开(公告)号：US20230238722A1

公开(公告)日：2023-07-27

申请号：US17999601

申请日：2021-06-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIRONORI TOMITA ,  ATSUSHI WATANABE

IPC: H01R12/52 ,  H01R4/48

CPC classification number: H01R12/52 ,  H01R4/48

Abstract: A connection device includes: a first substrate; a second substrate located above the first substrate and disposed opposite to the first substrate; a protrusion provided on an upper surface of the first substrate and protruding from the first substrate toward the second substrate; a first terminal provided on the protrusion; and a second terminal provided on a lower surface of the second substrate and disposed opposite to the first terminal. The first terminal includes a first connector and a second connector, and the first connector and the second connector are electrically joined together. The second terminal includes: a third connector that contacts the first connector; and a fourth connector that contacts the second connector, and the third connector and the fourth connector are electrically joined together. The third connector is located above the first connector. The second connector is located between a first side surface of the protrusion and the fourth connector. The third connector has elasticity and presses against the first connector. The fourth connector has elasticity and presses against the second connector.