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公开(公告)号：US20210062955A1
公开(公告)日：2021-03-04
申请号：US16960012
申请日：2019-03-11
Inventor： YUJI YAMAGISHI , RYOSUKE USUI , YUUICHI ABE , SHUN AOTA , RIKAKO IWASAKI
Abstract: Provided is a thermal insulator which can be prevented from having gaps. The thermal insulator includes a nonwoven fabric, and xerogel in interior spaces of the nonwoven fabric. The thermal insulator has a plurality of protrusions on a surface of the thermal insulator, a height of the protrusion ranges from 0.10t to 0.25t inclusive and a size of the protrusion at the surface of the thermal insulator ranges from t to 5t inclusive, where t is a thickness of the thermal insulator, and pores are provided inside the thermal insulator in a region provided with the protrusions.
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公开(公告)号：US20220090313A1
公开(公告)日：2022-03-24
申请号：US17413928
申请日：2019-10-10
Inventor： YASUTAKA HANASHIRO , RYOSUKE USUI , CHIHIRO SATOU , YUJI YAMAGISHI
Abstract: A fiber sheet having first and second surfaces and spaces therein is prepared. The spaces of the fiber sheet are impregnated with silica sol containing water glass and ethylene carbonate. Silica gel is formed by causing the silica sol with which the spaces of the fiber sheet is impregnated to gel while a difference between respective temperatures at the first and surfaces of the fiber sheet is equal to or larger than 50° C. The silica gel is hydrophobized, thereby providing a thermal insulation sheet. In the thermal insulation sheet, compressibilities of the first and second surfaces for a predetermined pressure applied thereto are different from each other. The thermal insulation sheet may be disposed between two battery cells so as to prevent one sell from influencing the other even if the one expands.
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公开(公告)号：US20210018135A1
公开(公告)日：2021-01-21
申请号：US16955889
申请日：2019-03-11
Inventor： CHIHIRO SATOU , RYOSUKE USUI
Abstract: An object of the present invention is to provide a thermal insulator which is easily position-adjusted when disposed in equipment. A plurality of projections are provided on at least one surface of thermal insulator including nonwoven fabric and xerogel in interior spaces of nonwoven fabric. With this configuration, fine positioning or the like is easily performed when thermal insulator is disposed, and a thickness increases by a height of projections, so that a thermal insulation effect can be improved. Thus, the thermal insulator can be used for thermal insulation of various types of equipment.
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公开(公告)号：US20210151237A1
公开(公告)日：2021-05-20
申请号：US16768903
申请日：2018-12-17
Inventor： TAKESHI FUJII , RYOSUKE USUI , CHIHIRO SATOU
Abstract: A reactor device includes a coil, a magnetic core having the coil thereon, a case accommodating the coil and the magnetic core, a cooling plate fixed to the case, an insulating sheet disposed between the coil and the cooling plate, a compressible graphite sheet disposed between the coil and the cooling plate, and a screw to fix the cooling plate to the case. The case has a screw hole and an opening provided therein. The screw passes through the screw hole to fix the cooling plate to the case. The coil contacts the insulating sheet through the opening of the case. The graphite sheet contacts the cooling plate. The reactor has high cooling performance and reliability.
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公开(公告)号：US20210050280A1
公开(公告)日：2021-02-18
申请号：US17050429
申请日：2019-05-13
Inventor： AKIHITO KONISHI , RYOSUKE USUI , NORIHIRO KAWAMURA
IPC: H01L23/373 , H01L21/48
Abstract: A highly reliable electronic device that efficiently dissipates generated heat and a method for manufacturing the electronic device are provided. The electronic device includes mount board, heat generating component mounted on mount board, pressing component provided above heat generating component, and film provided between heat generating component and pressing component. Further, liquid heat conductive material is provided between heat generating component and film and between pressing component and graphite-based carbonaceous film. Film contains graphite-based carbon and is compressed to predetermined compressibility by pressing component.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200370701A1
公开(公告)日：2020-11-26
申请号：US16769274
申请日：2018-12-20
Inventor： YUUICHI ABE , CHIHIRO SATOU , RYOSUKE USUI
Abstract: A heat insulation sheet includes a fiber sheet having spaces therein and a silica xerogel held in the spaces of the fiber sheet. The heat insulation sheet includes a thick region and a low compressible region thinner than the thick region. A compressibility of the low compressible region is equal to smaller than 5% upon having a pressure of 0.7 MPa applied to the low compressible region. This heat insulation sheet is superior in electrical insulation properties and thermal insulation properties, and secures a predetermined distance even in a case that the heat insulation sheet receives pressures from the both sides thereof, thus providing equipment with reliability.
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公开(公告)号：US20200340612A1
公开(公告)日：2020-10-29
申请号：US16610081
申请日：2018-05-30
Inventor： NORIHIRO KAWAMURA , CHIHIRO SATOU , RYOSUKE USUI
Abstract: The present disclosure is intended to provide a thermal insulation sheet that is resistant to being damaged even if enlarged in shape, as well as a multilayer thermal insulation sheet including such a thermal insulation sheet. The thermal insulation sheet includes a thermal insulator made of a nonwoven fabric that supports a xerogel in internal spaces. The thermal insulator has a plurality of through holes in an internal region in a plan view. Protective sheets are disposed on two respective surfaces of the thermal insulator. The protective sheets are joined together at a periphery of the thermal insulator and through inside the through holes.
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公开(公告)号：US20180197802A1
公开(公告)日：2018-07-12
申请号：US15746013
申请日：2017-03-01
Inventor： MASAYUKI NAGAMATSU , SHINYA MARUMO , JUNICHI KIMURA , TATSUYA KUNISATO , RYOSUKE USUI
CPC classification number: H01L23/12 , H01L23/28 , H01L23/3107 , H01L23/3142 , H01L23/48 , H01L23/49503 , H01L23/49548 , H01L23/50
Abstract: A semiconductor device includes a semiconductor element, a base, and an outer packaging resin. The base has a mounting surface, on which the semiconductor element is mounted, and a groove provided around the semiconductor element on the mounting surface. An outer packaging resin covers the semiconductor element and the base, and is fixed to the base by filling the groove. A bottom of the groove includes a first recess-projection having a first amplitude and a first repetition interval along an extending direction of the groove. The first recess-projection includes a second recess-projection having a second amplitude smaller than the first amplitude and a second repetition interval shorter than the first repetition interval along the extending direction of the groove.
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公开(公告)号：US20180145020A1
公开(公告)日：2018-05-24
申请号：US15580457
申请日：2016-07-04
Inventor： SHINICHI KOHDA , JUNICHI KIMURA , RYOSUKE USUI , TOMOHIDE OGURA , ATSUSHI WATANABE
IPC: H01L23/50 , H01L23/58 , H01L23/36 , H01L23/495
CPC classification number: H01L23/50 , H01L23/36 , H01L23/48 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49568 , H01L23/585 , H01L24/37 , H01L24/40 , H01L2224/0603 , H01L2224/37147 , H01L2224/48091 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H05K7/20 , H01L2924/00014
Abstract: This semiconductor device includes a semiconductor element mounted on a metal layer, first to third connection terminals that are provided on the semiconductor element, a first bus bar bonded to the first connection terminal, and a second bus bar bonded to the second connection terminal. The semiconductor element is bonded to the metal layer, and the first to third connection terminals are disposed on a top surface of the semiconductor element. One end of the first bus bar is bonded to the first connection terminal, another end of the first bus bar is an output unit, one end of the second bus bar is bonded to the second connection terminal, and another end of the second bus bar is bonded to the metal layer. A first surface of the semiconductor element and the second bus bar are at an identical potential.
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公开(公告)号：US20160307822A1
公开(公告)日：2016-10-20
申请号：US15196153
申请日：2016-06-29
Inventor： RYOSUKE USUI , TETSUZO UEDA
IPC: H01L23/473 , H01L23/495 , H01L49/02 , H01L23/053 , H01L23/528
CPC classification number: H01L23/473 , H01L23/053 , H01L23/49562 , H01L23/528 , H01L28/40 , H01L2924/0002 , H02M7/48 , H05K7/20927 , H01L2924/00
Abstract: A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.
Abstract translation: 半导体器件包括半导体元件，半导体元件，无源元件，冷却元件，第一导电元件和第二导电元件。 冷却构件设置在半导体模块和无源元件之间。 并且第一导电构件和第二导电构件电连接半导体模块和无源元件。 此外，第一导电构件和第二导电构件中的至少一个的两个或多个方面面向冷却构件。
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