公开(公告)号：US20250022682A1

公开(公告)日：2025-01-16

申请号：US18766729

申请日：2024-07-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shogo OKITA ,  Takahiro MIYAI ,  Yoshiyuki WADA ,  Naoaki TAKEDA ,  Toshiyuki TAKASAKI ,  Hisao NAGAI ,  Seiya NAGANO

IPC: H01J37/32

Abstract: A plasma generation unit includes: a first coil that includes first conductors that are connected in parallel to each other; and a first distribution portion that distributes, to each of the first conductors, first high frequency power to be supplied to the first coil. The first distribution portion includes: a first input portion to which the first high frequency power is input; a first branch portion at which the first high frequency power input to the first input portion is divided and delivered into first branch lines; and second branch portions at each of which a corresponding one of the first branch lines branches out into second branch lines. Each of the second branch lines is connected to one of first application portions that are included in the first conductors. The first branch lines have a substantially equal length. The second branch lines have a substantially equal length.

公开(公告)号：US20250014877A1

公开(公告)日：2025-01-09

申请号：US18761458

申请日：2024-07-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hisao NAGAI ,  Shogo OKITA ,  Toshiyuki TAKASAKI ,  Seiya NAGANO ,  Naoaki TAKEDA ,  Takahiro MIYAI

IPC: H01J37/32

Abstract: A plasma processing apparatus including a chamber, a placement unit which is disposed in the chamber and on which a substrate is to be placed, a plasma generation unit configured to generate a plasma within the chamber, a gas supply unit configured to supply a raw material gas of the plasma into the chamber, a measurement unit configured to measure and output a distribution information regarding a plasma distribution in the chamber, a control unit configured to control the plasma generation unit and the gas supply unit so as to repeat a unit processing on the substrate, a memory unit configured to store process conditions including conditions for the unit processing, and a modification unit configured to modify the process conditions. The measurement unit measures the distribution information (N) in the unit processing (N) at an Nth time, where N is an integer. When the distribution information (N) satisfies a predetermined condition, the modification unit modifies the process conditions in the unit processing (M) at an Mth time, where M is any integer equal to or greater than (N+1).