公开(公告)号：US09955604B2

公开(公告)日：2018-04-24

申请号：US14640873

申请日：2015-03-06

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Seiji Tokii ,  Manabu Tasaki

IPC分类号： H05K1/18 ,  H05K7/02 ,  H05K3/30 ,  H05K13/04 ,  H05K7/00 ,  H05K1/16 ,  H05K3/28 ,  H05K3/34

CPC分类号： H05K7/02 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/181 ,  H05K1/182 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/10007 ,  H05K2201/10159 ,  H05K2201/10583 ,  H05K2201/10674

摘要： A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.