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公开(公告)号：US12004298B2
公开(公告)日：2024-06-04
申请号：US17392817
申请日：2021-08-03
Applicant: Shinkawa Electric Co., Ltd.
Inventor： Kotaro Matsumoto , Hiroyuki Matsuda , Hiroshi Aoki , Masaru Terada , Ovel Emerson , Paul A. Lowe
CPC classification number: H05K1/181 , H05K5/0073 , H05K5/03 , H05K2201/09827 , H05K2201/10037 , H05K2201/10098 , H05K2201/10151 , H05K2201/10159 , H05K2201/10583
Abstract: Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.
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公开(公告)号：US20180294585A1
公开(公告)日：2018-10-11
申请号：US15950340
申请日：2018-04-11
Applicant: HARWIN PLC
Inventor： Robert Webber , Sam Bennett , Kevin Hunt , Robert Coldrick , Graham Cunningham , Mark Plested , Andrew Mcquilken
CPC classification number: H01R12/7035 , H01R12/57 , H01R12/718 , H01R13/11 , H01R13/111 , H01R43/16 , H01R43/205 , H05K1/184 , H05K2201/10325 , H05K2201/10583
Abstract: A female electrical socket for receiving an electrical pin and for connection to a PCB is provided. The socket provides a body having a first end and a second end, each having an opening, wherein either opening is configured to receive a male electrical pin to form a connection with the female socket, and wherein the body has a central longitudinal axis. The socket further provides a plurality of contact fingers on the body, wherein a first end of each of the fingers is attached to the body and a second end of each of the fingers is radially directed inwards relative to the first end towards the central longitudinal axis to provide a retention force to engage with the electrical pin. At least one wing extends outwardly from the first end of the body. A corresponding method of manufacturing the socket is also provided.
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3.发明授权公开(公告)号：US09788436B2
公开(公告)日：2017-10-10
申请号：US14939761
申请日：2015-11-12
Inventor： Bruce V. Hughes
CPC classification number: H05K3/107 , H05K1/0284 , H05K1/119 , H05K1/186 , H05K3/0014 , H05K3/10 , H05K3/4682 , H05K2201/056 , H05K2201/09018 , H05K2201/10583 , Y10T29/49155
Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.
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公开(公告)号：US20170222338A1
公开(公告)日：2017-08-03
申请号：US15399317
申请日：2017-01-05
Applicant: BIOTRONIK SE & Co. KG
Inventor： Martin Henschel
IPC: H01R11/01 , A61N1/375 , H01M2/20 , H01R4/02 , B23K26/242
CPC classification number: H01R11/01 , A61N1/3758 , B23K26/22 , B23K26/242 , B23K26/28 , B23K26/32 , B23K2101/36 , B23K2101/38 , H01M2/204 , H01R4/029 , H01R43/0221 , H05K1/0293 , H05K3/222 , H05K3/328 , H05K3/4015 , H05K2201/10053 , H05K2201/10181 , H05K2201/10242 , H05K2201/10363 , H05K2201/10583 , H05K2203/107 , H05K2203/173
Abstract: A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.
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公开(公告)号：US20170042032A1
公开(公告)日：2017-02-09
申请号：US15302769
申请日：2015-04-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung Yong Joo , Jin Hyung Lee , Gil Yong Chang
CPC classification number: H05K1/182 , G02F1/133308 , G02F1/133385 , G02F2001/133314 , G02F2001/133317 , G02F2001/13332 , H01G2/06 , H05K3/301 , H05K3/306 , H05K7/12 , H05K2201/10128 , H05K2201/10393 , H05K2201/10583 , H05K2201/10651 , H05K2201/2036
Abstract: According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part.
Abstract translation: 根据本公开的实施例，由于电子部件通过夹具固定在PCB上，因此可能不需要诸如焊接或粘合剂的后处理。 此外，由于PCB可以通过夹具与相邻配置间隔开，所以PCB的有效布局是可能的，从而提高PCB的生产率。 根据本公开的一个方面，提供了一种夹具，其包括被构造成围绕电子部件的外表面的至少一部分的固定部，从固定部延伸并且穿透印刷电路板 （PCB），设置在固定部分或连接部分中的至少一个中的干涉部分，并且被构造成被PCB干涉，以及从连接部分或固定部分中的至少一个突出的间隔部分。
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Patent Agency Ranking
公开(公告)号：US20160163613A1
公开(公告)日：2016-06-09
申请号：US14900651
申请日：2014-06-24
Applicant: DENSO CORPORATION
Inventor： Shinya UCHIBORI , Norihisa IMAIZUMI , Masayuki TAKENAKA
IPC: H01L23/31 , H05K1/18 , H01L23/498
CPC classification number: H01L23/3157 , H01L23/3121 , H01L23/49811 , H01L23/49827 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/284 , H05K3/301 , H05K3/3415 , H05K2201/09436 , H05K2201/10462 , H05K2201/10515 , H05K2201/10537 , H05K2201/10583 , H05K2201/10757 , H05K2201/2036 , H01L2924/00012 , H01L2924/00
Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.
Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。
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7.发明授权Circuit board assembly using metal plates as conducting medium embedded therein 有权使用金属板作为导电介质嵌入其中的电路板组件公开(公告)号：US09307628B2
公开(公告)日：2016-04-05
申请号：US13868575
申请日：2013-04-23
Applicant: KING SHING INDUSTRIAL CO., LTD.
Inventor： Chun-Chin Shin
IPC: H05K7/20 , H05K1/03 , H05K1/16 , B23P19/00 , H05K1/02 , H05K1/18 , H05K3/20 , G06F1/20 , H05K1/14
CPC classification number: H05K1/02 , G06F1/20 , H05K1/0203 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/202 , H05K2201/042 , H05K2201/09027 , H05K2201/09063 , H05K2201/09118 , H05K2201/10583
Abstract: A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.
Abstract translation: 电路板组件包括用作导电介质的金属板，封装有金属板的封装，并且在封装中设置有限定在孔中的孔，以允许将金属板延伸出用于电连接的封装以及牢固地安装在其上的电子部件 封装并电连接到金属板以形成闭环。
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公开(公告)号：US09204547B2
公开(公告)日：2015-12-01
申请号：US13864656
申请日：2013-04-17
Inventor： Bruce V. Hughes
CPC classification number: H05K3/107 , H05K1/0284 , H05K1/119 , H05K1/186 , H05K3/0014 , H05K3/10 , H05K3/4682 , H05K2201/056 , H05K2201/09018 , H05K2201/10583 , Y10T29/49155
Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.
Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和主动的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状，诸如，例如，圆柱形或球形，以便形成中空的，弯曲的非平面结构的心轴来制造。
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公开(公告)号：US20140313684A1
公开(公告)日：2014-10-23
申请号：US13864656
申请日：2013-04-17
Inventor： Bruce V. Hughes
CPC classification number: H05K3/107 , H05K1/0284 , H05K1/119 , H05K1/186 , H05K3/0014 , H05K3/10 , H05K3/4682 , H05K2201/056 , H05K2201/09018 , H05K2201/10583 , Y10T29/49155
Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.
Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和有源的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状的心轴上制造，例如圆柱体或球体，以便形成中空弯曲的非平面结构。
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公开(公告)号：US08553429B2
公开(公告)日：2013-10-08
申请号：US12679684
申请日：2008-09-24
Applicant: Niall McNamara , Brendan Maguire , Denis O'Sullivan , SeanGearoid McMahon , Colm Reidy , Michael Crampton
Inventor： Niall McNamara , Brendan Maguire , Denis O'Sullivan , SeanGearoid McMahon , Colm Reidy , Michael Crampton
CPC classification number: H05K3/301 , H05K3/308 , H05K7/12 , H05K2201/09827 , H05K2201/10015 , H05K2201/10325 , H05K2201/10583 , H05K2201/1059 , H05K2201/10606
Abstract: An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (C1) such as capacitor, diode, or resistor to a mounting member such as a printed circuit board in a horizontal or vertical orientation. The mounting assembly can have a housing (12) and a sleeve (14) placed around the electrical component which cooperates with the housing to retain the electrical component to the housing. A substantially inner cylindrical wall (32) of the housing can taper inward from an entrance (34) end to a rear wall (18) to form a tapering or narrowing chamber (30). The sleeve can have a slit that runs along the entire length of the sleeve and a tapered outer surface (28) that cooperates with the tapered chamber to clamp or compress against the electrical component as the sleeve is inserted into the housing. The lack of appreciable expansion of the housing creates a tight friction fit to secure the sleeve to the housing. The sleeve can also include a plank that is received in an opening in the housing which can be heat staked to reinforce the friction fit taper lock between the housing and sleeve. The housing can be dimensioned to mount more than one electrical component diameter size by varying the dimensions of the sleeve, and in particular the thickness of sleeve.
Abstract translation: 公开了一种用于将诸如电容器，二极管或电阻器的圆柱形电气元件（C1）以水平或垂直取向附接到诸如印刷电路板的安装构件的电气部件安装组件。 安装组件可以具有壳体（12）和围绕电气部件设置的套筒（14），该套件与壳体配合以将电气部件保持在壳体上。 壳体的基本上内圆柱形的壁（32）可以从入口（34）端向后壁（18）向内锥形以形成锥形或变窄的腔室（30）。 套筒可以具有沿套筒的整个长度延伸的狭缝和锥形外表面（28），锥形外表面（28）与套筒插入到壳体中时与锥形室配合以夹紧或压缩电气部件。 外壳缺乏明显的膨胀产生紧密的摩擦配合以将套筒固定到壳体上。 套筒还可以包括容纳在壳体中的开口中的板材，该板材可以被热铆接以加强壳体和套筒之间的摩擦配合锥形锁定。 可以通过改变套筒的尺寸，特别是套筒的厚度来确定外壳的尺寸以安装多于一个电气部件的直径尺寸。
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