公开(公告)号：US11140788B2

公开(公告)日：2021-10-05

申请号：US16268519

申请日：2019-02-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsuya Tanaka ,  Masahiko Akasaka ,  Koji Sakurai ,  Toshihiko Nagaya

IPC: H01R9/00 ,  H05K3/02 ,  H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  H05K13/04 ,  B23K101/42

Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

公开(公告)号：US11013160B2

公开(公告)日：2021-05-18

申请号：US16123122

申请日：2018-09-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsuya Tanaka ,  Masahiko Akasaka ,  Koji Sakurai ,  Toshihiko Nagaya

IPC: H05K3/30 ,  H05K13/04 ,  H05K3/34 ,  H05K3/32 ,  H05K3/12

Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.