公开(公告)号：US09796035B2

公开(公告)日：2017-10-24

申请号：US14539314

申请日：2014-11-12

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Seiya Kuroda ,  Tetsuya Tanaka ,  Michinori Tomomatsu

IPC: B23K31/02 ,  B23K3/06 ,  B41F15/44 ,  H05K13/04 ,  B23K1/00 ,  H05K3/12 ,  H05K3/34

CPC classification number: B23K3/0638 ,  B23K1/0016 ,  B41F15/44 ,  H05K3/1233 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2203/0139

Abstract: A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a flexible filling squeegee which performs a squeegeeing operation in which the filling squeegee is moved relative to the mask plate in a printing direction; and a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction and to be movable together with the filling squeegee in the printing direction, and which scraps off the paste remaining on the mask plate after passage of the filling squeegee. In the squeegeeing operation, the filling squeegee is pushed up and bent by the paste to provide a clearance between a bottom end of the filling squeegee and the mask plate with the paste interposed therebetween so that the pattern holes are filled with paste with a prescribed filling pressure.

公开(公告)号：US11140788B2

公开(公告)日：2021-10-05

申请号：US16268519

申请日：2019-02-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsuya Tanaka ,  Masahiko Akasaka ,  Koji Sakurai ,  Toshihiko Nagaya

IPC: H01R9/00 ,  H05K3/02 ,  H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  H05K13/04 ,  B23K101/42

Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

公开(公告)号：US11013160B2

公开(公告)日：2021-05-18

申请号：US16123122

申请日：2018-09-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsuya Tanaka ,  Masahiko Akasaka ,  Koji Sakurai ,  Toshihiko Nagaya

IPC: H05K3/30 ,  H05K13/04 ,  H05K3/34 ,  H05K3/32 ,  H05K3/12

Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.