摘要:
A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.
摘要:
A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.
摘要:
A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.
摘要:
Detecting a fouled air filter in a computer equipment enclosure that includes an air filter, a supply plenum connecting the air filter and the computer equipment enclosure, a fan operating at a current fan speed, and a filter monitoring module connected for data communications to a management module. Detecting a fouled air filter according to embodiments of the present invention includes calculating, by the filter monitoring module, a pressure differential across the air filter; determining, for the current fan speed by the filter monitoring module in dependence upon a pressure differential profile for the air filter, whether the calculated pressure differential across the air filter exceeds a predetermined threshold value; and if the calculated pressure differential across the air filter exceeds the predetermined threshold value, reporting, by the filter monitoring module to the management module, that the calculated pressure differential across the air filter exceeds the predetermined threshold value.
摘要:
The present invention provides methods for aligning a fiber optic cable with an optical component on a device carrier using a fiber optic lens assembly. One method provides that movement of the lens assembly is fixed with respect to the fiber optic cable. Light is sent through the lens assembly. The fixed lens assembly and fiber optic cable are moved with respect to the device carrier. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the device carrier according to the monitored light. Another method provides that movement of the lens assembly is fixed with respect to the device carrier. Light is sent through the lens assembly. The fixed lens assembly and device carrier are moved with respect to the fiber optic cable. The light sent though the fixed lens assembly is monitored, and movement of the fixed lens assembly is fixed with respect to the fiber optic cable according to the monitored light. The present invention further provides aligned transceiver assemblies having a fiber optic cable, device carrier, and fiber optic lens assembly having features that facilitate alignment and fixing according to the invention methods.
摘要:
The packaging architecture for a multiple array transceiver using a flexible cable of the present invention provides a 90-degree transition between an optical signal input at a communications chassis bulkhead and an interior board within the communications chassis. The packaging architecture system comprises a forward vertical carrier having an optical converter, a paddle card, a flexible cable operably connected between the forward vertical carrier and the paddle card, and a rearward horizontal I/O block operably connected to the paddle card, the rearward horizontal I/O block oriented about 90 degrees from the forward vertical carrier. The multiple array transceiver makes the 90-degree transition within a narrow gap established by industry and manufacturer standards. The multiple array transceiver further provides cooling through a heat sink.
摘要:
A latch selectively secures a compute node enclosure into a chassis bay. The latch comprises a frame securable to a proximal end of the compute node enclosure. A handle is pivotally secured to the frame intermediate a proximal end of the handle and a distal end of the handle so that the handle can be pivoted between a closed position and an open position. A proximal end of a pawl is pivotally coupled at to the distal end of the handle, wherein the pawl includes a landing at a distal end of the pawl and a latch key intermediate proximal and distal ends of the pawl. Movement of the handle positions the pawl into engagement with a slot in chassis bay to assist installation and removal of the compute node enclosure.
摘要:
A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.
摘要:
A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.
摘要:
One embodiment includes the provision of a novel insert-and-rotate connection for a daughter card, such as in a blade computer system. The daughter card has both a card edge with a plurality of card edge contacts and a mezzanine connector spaced from the card edge. An interposer mounted on the motherboard has a card edge connector and a midplane connector in communication with the card edge connector. The card edge connector includes a socket for receiving the card edge of the daughter card with the daughter card at an acute angle to the motherboard, to avoid interference between the mezzanine connector on the daughter card and a corresponding mezzanine connector on the motherboard. Once the card edge is inserted into the socket of the card edge connector, the socket allows for rotation of the daughter card about the received card edge. The mezzanine connectors are aligned for connection in response to rotation of the daughter card about the received card edge. The contacts on the card edge also contact the corresponding socket contacts in response to the rotation of the card.