公开(公告)号：US20050082490A1

公开(公告)日：2005-04-21

申请号：US10482017

申请日：2001-12-21

Applicant: Patrick Perillat

Inventor： Patrick Perillat

IPC: H01L31/0203 ,  G01J1/00 ,  G01T1/24 ,  H01L27/00

CPC classification number: H01L31/0203 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component (6), a rear face of which is attached to a front face of a mounting and electrical connection support (2) and a front face of which comprises an optical sensor (9), means (11) for electrically connecting the semiconductor component to the support, a transparent chip (12) placed in front of the semiconductor component, which lies at least in front of the optical sensor, and encapsulation means (21) comprising an encapsulation material which envelopes, in front of the support, the periphery of the semiconductor component and of the chip, without covering at least the central part of the front face of this chip.

Abstract translation: 光学半导体封装及其制造方法，该封装包括半导体部件（6），其后表面附接到安装和电连接支撑件（2）的前表面，其前表面包括光学传感器 （9），用于将半导体部件电连接到支撑体的装置（11），位于至少在光学传感器前面的放置在半导体部件前面的透明芯片（12）以及包括 封装材料，其在支撑体前面包围半导体部件和芯片的周边，而不至少覆盖该芯片的前表面的中心部分。

公开(公告)号：US20050006732A1

公开(公告)日：2005-01-13

申请号：US10781557

申请日：2004-02-18

Applicant: Patrick Perillat

Inventor： Patrick Perillat

IPC: H01L23/31 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L31/02325 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor package containing an integrated-circuit chip, characterized in that it comprises a leadframe formed from spaced-apart electrical connection leads (5), the integrated-chip being fixed to or supported by a front surface of the leads, electrical connection means (16) for connecting the integrated-chip to the electrical connection leads and a block (20) of an encapsulation material in which at least the electrical connection leads are at least partly embedded.

Abstract translation: 包含集成电路芯片的半导体封装，其特征在于，它包括由间隔开的电连接引线（5）形成的引线框架，所述集成芯片被固定到所述引线的前表面或由所述引线的前表面支撑，所述电连接装置 ），用于将集成芯片连接到电连接引线和至少部分地嵌入至少电连接引线的封装材料的块（20）。

公开(公告)号：US07030471B2

公开(公告)日：2006-04-18

申请号：US10781557

申请日：2004-02-18

Applicant: Patrick Perillat

Inventor： Patrick Perillat

IPC: H01L23/495

CPC classification number: H01L31/0203 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L31/02325 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor package containing an integrated-circuit chip, characterized in that it comprises a leadframe formed from spaced-apart electrical connection leads (5), the integrated-chip being fixed to or supported by a front surface of the leads, electrical connection means (16) for connecting the integrated-chip to the electrical connection leads and a block (20) of an encapsulation material in which at least the electrical connection leads are at least partly embedded.

Abstract translation: 包含集成电路芯片的半导体封装，其特征在于，它包括由间隔开的电连接引线（5）形成的引线框架，所述集成芯片被固定到所述引线的前表面或由所述引线的前表面支撑，所述电连接装置 ），用于将集成芯片连接到电连接引线和至少部分地嵌入至少电连接引线的封装材料的块（20）。