摘要:
A method of forming a body-tie. The method includes forming the body-tie during an STI scheme of an SOI process. During the STI scheme, a first trench is formed. The first trench stops before a buried oxide layer of the SOI substrate. The first trench may determine a height of body tie that is shared between at least two FETs. A second trench may also be formed within the first trench. The second trench stops in the SOI substrate. The second trench defines the location and shape of a body-tie. Once the location and shape of the body-tie are defined, an oxide is deposited above the body-tie. The deposited oxide prevents certain implants from entering the body tie. By preventing these implants, a source and a drain implant may be self-aligned to the source and drain areas without requiring the use of the photoresist mask to shield the body tie regions from the source and drain implant.
摘要:
Disclosed is a method of fabricating a silicon-on-insulator (SOI) device that enables high device densities and mitigates variances in carrier mobility and saturation drain current (Idsat). The fabrication method incorporates one or more high temperature nitrogen anneal processes. The high temperature nitrogen anneal nitridizes the interfaces between the n-well and p-well silicon islands and the buried oxide layer. The high temperature nitrogen anneal also nitridizes the interfaces between the n-well and p-well silicon islands and the shallow trench isolation structure. The presence of diffused nitrogen at these interfaces substantially prevents compressive stresses on the n-well and p-well silicon islands, and substantially prevents upward bending of the n-well and p-well silicon islands, which cause variances in carrier mobility and Idsat.
摘要翻译:公开了一种制造绝缘体上硅(SOI)器件的方法,其能够实现高器件密度并减轻载流子迁移率和饱和漏极电流的变化(Id)。 该制造方法包括一个或多个高温氮退火工艺。 高温氮退火使n阱和p阱硅岛和掩埋氧化物层之间的界面氮化。 高温氮退火还使n阱和p阱硅岛与浅沟槽隔离结构之间的界面氮化。 在这些界面处扩散氮的存在基本上防止了n阱和p阱硅岛上的压缩应力,并且基本上防止了n阱和p阱硅岛的向上弯曲,这导致载流子迁移率的变化, SUB> sat SUB>。
摘要:
In a process of making a magnetoresistive memory device, a mask layout is produced by use of any suitable design tool. The mask layout is laid out in grids having a central grid forming a central section and grids forming bit end sections, and the grids of the bit end sections are rectangles. A mask is made by use of the mask layout, and the mask has stepped bit ends. The mask is used to make a magnetic storage layer having tapered bit ends, to make a magnetic sense layer having tapered bit ends, and to make a non-magnetic layer having tapered bit ends. The non-magnetic layer is between the magnetic sense layer and the magnetic storage layer.
摘要:
A resistor capacitor structure and a method of fabrication. A resistor capacitor structure provides a capacitance between at least two nodes within a microelectronic circuit. A bottom plate of the resistor capacitor structure comprises a resistance layer, which in turn provides a resistance path between an additional node within the circuit. The resistor capacitor structure may be formed on top or within interlevel dielectric layers. The resistance layer, alternatively, may be used to fill a cavity located between interlevel dielectric layers and accordingly provide a resistance path between the interlevel dielectric layers.
摘要:
Neutron detection cells and corresponding methods of detecting charged particles that make efficient use of silicon area are set forth. Three types of circuit cells/arrays are described: state latching circuits, glitch generating cells, and charge loss circuits. An array of these cells, used in conjunction with a neutron conversion film, increases the area that is sensitive to a strike by a charged particle over that of an array of SRAM cells. The result is a neutron detection cell that uses less power, costs less, and is more suitable for mass production.
摘要:
Non-planar SOI devices that include an “area-efficient” body tie are disclosed. The device includes a bulk substrate, an insulator layer formed on a surface of the bulk substrate, and a silicon body formed on a surface of the insulator layer. The silicon body preferably includes (i) a non-planar channel connecting a source region and a drain region, and (ii) a body tie that is adjacent to the channel and couples the channel to a voltage potential. The device further includes a gate dielectric formed on the channel and a gate material formed on the gate dielectric.
摘要:
An output buffer with built-in ESD protection is disclosed. The built-in ESD protection is preferably formed using transistors from the sea-of-transistors or sea-of-gates region of the integrated circuit, which may eliminate the need for dedicated ESD devices, and in particular, dedicated ESD devices that are pre-fabricated into the under-layers in and around the perimeter of the integrated circuit.
摘要:
A method for digital programmable optimization of a mixed-signal circuit is provided. The method comprises dividing up one or more transistor devices of the mixed-signal circuit into one or more transistor segments, with each transistor segment including a body tie bias terminal. Each body tie bias terminal is coupled to at least one voltage bias, either by placing each body tie bias terminal in signal communication with one or more bias nodes in the mixed-signal circuit, or by placing each body tie bias terminal in signal communication with a non-precision bias voltage source. Each body tie terminal is also arranged to be in signal communication with a separate one of one or more digital programmable storage elements.
摘要:
Neutron detection cells and corresponding methods of detecting charged particles that make efficient use of silicon area are set forth. Three types of circuit cells/arrays are described: state latching circuits, glitch generating cells, and charge loss circuits. An array of these cells, used in conjunction with a neutron conversion film, increases the area that is sensitive to a strike by a charged particle over that of an array of SRAM cells. The result is a neutron detection cell that uses less power, costs less, and is more suitable for mass production.
摘要:
A MOS transistor formed in a silicon on insulator structure includes a rectifying connection between a body portion and the gate. The connection decreases the threshold voltage of the transistor in the reverse bias state and limits a difference in voltage between the body and gate in the forward bias state of the rectifying contact.