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公开(公告)号：USD694760S1
公开(公告)日：2013-12-03
申请号：US29430669
申请日：2012-08-28
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公开(公告)号：USD694247S1
公开(公告)日：2013-11-26
申请号：US29430670
申请日：2012-08-28
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公开(公告)号：USD763208S1
公开(公告)日：2016-08-09
申请号：US29431029
申请日：2012-08-31
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公开(公告)号：US20130344297A1
公开(公告)日：2013-12-26
申请号：US13532387
申请日：2012-06-25
CPC分类号： G01J3/46 , B07C5/34 , B07C5/3412 , Y10T428/24802
摘要： Identification of a material composition. The material composition is configured with a sequential pattern applied to one or more surfaces of the body. The sequential pattern identifies the specific material composition. A discrete section or sub-section of the material is analyzed, after which the discrete section or sub-section may be sorted for recycling.
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公开(公告)号：US09089076B2
公开(公告)日：2015-07-21
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管连接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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公开(公告)号：USD564510S1
公开(公告)日：2008-03-18
申请号：US29250903
申请日：2006-12-05
申请人： Aaron R. Cox , Jason E. Minyard
设计人： Aaron R. Cox , Jason E. Minyard
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公开(公告)号：US20140009882A1
公开(公告)日：2014-01-09
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管联接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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公开(公告)号：USD555161S1
公开(公告)日：2007-11-13
申请号：US29247721
申请日：2006-07-06
申请人： Aaron R. Cox , Jason E. Minyard
设计人： Aaron R. Cox , Jason E. Minyard
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9.发明授权公开(公告)号：US08376293B2
公开(公告)日：2013-02-19
申请号：US12916251
申请日：2010-10-29
IPC分类号： F16M11/00
CPC分类号： H05K7/1489 , F16B9/02 , Y10T29/49826 , Y10T29/49959
摘要： A mounting system, in one embodiment, includes two support ears, each support ear adapted for securing an electronic component to a rack. Each support ear includes a planar portion which includes at least one hole for receiving one or more fasteners for coupling to a side of the electronic component and a portion extending perpendicular to the planar portion having a frontal area. The perpendicular portion includes at least one pin positioned on a side opposite the frontal area for engaging with at least one hole in the rack, the at least one pin extending normal to the perpendicular portion in a direction about parallel to a plane of the planar portion, and a first fastener positioned on the side opposite the frontal area for coupling to the rack, the first fastener extending normal to the perpendicular portion in the direction about parallel to the plane of the planar portion.
摘要翻译： 在一个实施例中，安装系统包括两个支撑耳，每个支撑耳适用于将电子部件固定到机架上。 每个支撑耳包括平面部分，其包括至少一个孔，用于接收用于耦合到电子部件的一侧的一个或多个紧固件和垂直于具有前部区域的平面部分延伸的部分。 所述垂直部分包括位于与所述前部区域相对的一侧的至少一个销，用于与所述齿条中的至少一个孔接合，所述至少一个销在垂直于垂直于所述平面部分的平面的平行方向上延伸 以及位于与前部区域相对的一侧的第一紧固件，用于联接到所述齿条，所述第一紧固件在与所述平面部分的平面平行的方向上垂直于所述垂直部分延伸。
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10.发明申请公开(公告)号：US20120104200A1
公开(公告)日：2012-05-03
申请号：US12916251
申请日：2010-10-29
CPC分类号： H05K7/1489 , F16B9/02 , Y10T29/49826 , Y10T29/49959
摘要： A mounting system, in one embodiment, includes two support ears, each support ear adapted for securing an electronic component to a rack. Each support ear includes a planar portion which includes at least one hole for receiving one or more fasteners for coupling to a side of the electronic component and a portion extending perpendicular to the planar portion having a frontal area. The perpendicular portion includes at least one pin positioned on a side opposite the frontal area for engaging with at least one hole in the rack, the at least one pin extending normal to the perpendicular portion in a direction about parallel to a plane of the planar portion, and a first fastener positioned on the side opposite the frontal area for coupling to the rack, the first fastener extending normal to the perpendicular portion in the direction about parallel to the plane of the planar portion.
摘要翻译： 在一个实施例中，安装系统包括两个支撑耳，每个支撑耳适用于将电子部件固定到机架上。 每个支撑耳包括平面部分，其包括至少一个孔，用于接收用于耦合到电子部件的一侧的一个或多个紧固件和垂直于具有前部区域的平面部分延伸的部分。 所述垂直部分包括位于与所述前部区域相对的一侧的至少一个销，用于与所述齿条中的至少一个孔接合，所述至少一个销在垂直于垂直于所述平面部分的平面的平行方向上延伸 以及位于与前部区域相对的一侧的第一紧固件，用于联接到所述齿条，所述第一紧固件在与所述平面部分的平面平行的方向上垂直于所述垂直部分延伸。
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