-
1.发明授权
公开(公告)号：US5298715A
公开(公告)日：1994-03-29
申请号：US874666
申请日：1992-04-27
CPC分类号： B29C66/69 , B23K1/0056 , B23K20/10 , B23K26/06 , B23K26/0604 , B29C65/08 , H05K3/341 , H05K3/3494
摘要： A combination of laser energy and ultrasonic energy is used for soldering an insulated wire to a pad located on a substrate. The combined laser energy and ultrasonic energy strips the insulation from the wire and solders the resulting bare wire to the pad. The method has particular use for soldering insulated wire to pads located on heat sensitive substrates or to pads located in close proximity to heat sensitive devices. A principal application is for soldering fine insulated wires for connecting a thin film magnetic head to a circuit carrier substrate.
摘要翻译： 使用激光能量和超声波能量的组合来将绝缘电线焊接到位于基板上的焊盘。 组合的激光能量和超声波能量从电线剥离绝缘体，并将所得裸线焊接到焊盘。 该方法特别用于将绝缘导线焊接到位于热敏基板上的焊盘或靠近热敏器件的焊盘。 主要应用是用于焊接用于将薄膜磁头连接到电路载体衬底的细绝缘电线。
-
公开(公告)号：US4396140A
公开(公告)日：1983-08-02
申请号：US228954
申请日：1981-01-27
CPC分类号： H05K3/3484 , H05K3/3426 , H05K2201/10166 , H05K2201/10984 , H05K2203/0338 , H05K2203/043 , Y02P70/613
摘要： Disclosed is a method of bonding electronic components (14) to metallized substrates (21) by soldering. The solder is first deposited on an unmetallized substrate (10) in a pattern of discrete pads (11, 12, 13) corresponding to the leads (28, 29, 30) of the components to be bonded. The component leads are then placed on the pads and the solder is reflowed. The solder thereby adheres to the leads so that a controlled amount of solder will remain on each lead when the component is lifted from the substrate. The components can then be soldered to an appropriate metallized substrate.
摘要翻译： 公开了通过焊接将电子部件（14）与金属化基板（21）接合的方法。 焊料首先以对应于要结合的部件的引线（28,29,30）的离散焊盘（11,12,13）的图案沉积在未金属化的基板（10）上。 然后将部件引线放置在焊盘上，并且焊料被回流。 因此焊料粘附到引线上，使得当组件从衬底提起时，受控量的焊料将保留在每个引线上。 然后将组分焊接到合适的金属化基底上。
-
搜索结果
2 条记录 (耗时 0.019 秒)
