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    SELECTIVE SOLDERING APPARATUS WITH MULTIPLE PUMPS AND THIMBLE PLATE AND NITROGEN COOLED PUMP BEARING ASSEMBLY
    6.
    发明申请
    SELECTIVE SOLDERING APPARATUS WITH MULTIPLE PUMPS AND THIMBLE PLATE AND NITROGEN COOLED PUMP BEARING ASSEMBLY 审中-公开
    选择性焊接设备，多个泵和三通板和氮气冷却泵轴承总成

    公开(公告)号：US20090095793A1

    公开(公告)日：2009-04-16

    申请号：US11569584

    申请日：2005-05-25

    申请人： Michael Tombs ,  Darren Harvey

    发明人： Michael Tombs ,  Darren Harvey

    IPC分类号： B23K3/06

    CPC分类号： B23K3/0653 ,  F16C37/00

    摘要： A soldering apparatus comprises a solder bath, a body positioned in the bath and having a plurality of main conduits for feeding solder from a solder pump to a nozzle or thimble. Each conduit communicates with a pump chamber and a conduit in a thimble plate on which the thimbles are mounted. The thimble plate is readily replaced by lifting the main body clear of the solder on lifting mechanisms. Thimbles can be positioned at any desired location on the plate, conduits being formed in the plate to lead from the outlet of a respective conduit.

    摘要翻译： 焊接装置包括焊料槽，位于熔池中的主体，并且具有多个用于将焊料从焊料泵供给到喷嘴或套管的主导管。 每个导管与安装套管的套管中的泵室和导管连通。 在提升机构上，通过将主体从焊料上提升而容易地取代套管板。 套管可以定位在板上的任何所需位置，导管形成在板中以从相应导管的出口引出。

    SELECTIVE SOLDERING APPARATUS WITH JET WAVE SOLDER JET AND NITROGEN PREHEAT
    8.
    发明申请
    SELECTIVE SOLDERING APPARATUS WITH JET WAVE SOLDER JET AND NITROGEN PREHEAT 审中-公开
    选择性焊接设备，喷射波峰喷射和氮气预处理

    公开(公告)号：US20100243718A1

    公开(公告)日：2010-09-30

    申请号：US12813421

    申请日：2010-06-10

    申请人： Alexander J. Ciniglio ,  Charles Kent ,  Darren Harvey ,  Colin Drain

    发明人： Alexander J. Ciniglio ,  Charles Kent ,  Darren Harvey ,  Colin Drain

    IPC分类号： B23K1/20 ,  B23K3/06 ,  B23K3/08

    CPC分类号： B23K3/0653 ,  B23K1/085

    摘要： Solder is pumped through a nozzle to produce a jet 12 of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle 2 is mounted on a flange 16 held between slip rings 18, 20 so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit 68, 70 may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate 92 downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube 204, 212, 224 for delivering heated nitrogen gas to pre-heat a region to be soldered.

    摘要翻译： 焊料通过喷嘴泵送以产生焊料的射流1​​2，并且印刷电路板上的引线通过喷射器以将它们焊接到板轨道。 喷嘴2安装在保持在滑环18,20之间的凸缘16上，使得喷嘴可以旋转以改变射流的方向。 可以提供与导管成一直线以提供氮气氛的氮气导管68,70。 在喷嘴出口下游的薄板92接触射流，并且当引线横过通过射流时，抑制侧向波动。 该装置还可以包括用于输送加热的氮气以预加热待焊接的区域的管204,212,224。