公开(公告)号：US20050109823A1

公开(公告)日：2005-05-26

申请号：US10721494

申请日：2003-11-25

申请人： Peter Gruber ,  Lannie Bolde

发明人： Peter Gruber ,  Lannie Bolde

IPC分类号： B23K3/053 ,  B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K3/053 ,  B23K3/0607

摘要： A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

摘要翻译： 提供具有储存器，驱动单元，第一引线和第二引线的焊料馈送装置。 储存器将固体焊丝熔化成熔融焊料，而驱动单元选择性地将固体焊丝馈送到储存器中。 第一和第二引线与驱动单元电连通。 第一引线定位在储存器中，使得当熔融焊料达到触发水平时，其通过熔融焊料与第二引线电连通，但是当电平低于触发电平时它不与第二引线电连通 。 驱动单元基于第一和第二引线之间的电连通状态将固体焊丝馈送到储存器中。

公开(公告)号：US20060231591A1

公开(公告)日：2006-10-19

申请号：US11426986

申请日：2006-06-28

申请人： Peter Gruber ,  Lannie Bolde

发明人： Peter Gruber ,  Lannie Bolde

IPC分类号： A47J36/02

CPC分类号： B23K3/0638 ,  B23K3/053 ,  B23K3/0607

摘要： A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

摘要翻译： 提供具有储存器，驱动单元，第一引线和第二引线的焊料馈送装置。 储存器将固体焊丝熔化成熔融焊料，而驱动单元选择性地将固体焊丝馈送到储存器中。 第一和第二引线与驱动单元电连通。 第一引线定位在储存器中，使得当熔融焊料达到触发水平时，其通过熔融焊料与第二引线电连通，但是当电平低于触发电平时它不与第二引线电连通 。 驱动单元基于第一和第二引线之间的电连通状态将固体焊丝馈送到储存器中。

公开(公告)号：US20050082352A1

公开(公告)日：2005-04-21

申请号：US10605673

申请日：2003-10-16

申请人： Lannie Bolde ,  Jac Burke ,  Kevin Gallagher ,  Howard Hutchinson ,  Juan Jeri

发明人： Lannie Bolde ,  Jac Burke ,  Kevin Gallagher ,  Howard Hutchinson ,  Juan Jeri

IPC分类号： B23K1/018 ,  B23K31/02

CPC分类号： B23K1/018 ,  B23K2101/40

摘要： A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply a loading force to the semiconductor device. The assembly of the substrate and the semiconductor device are loaded into the fixture with the shearing element proximate the semiconductor device, and heating the solder connections of the assembly in the fixture are heated proximate the substrate to a predetermined temperature by applying a heat source to a surface of the substrate distal from the semiconductor device.

摘要翻译： 一种用剪切元件将夹具中的半导体器件与衬底分离的方法和装置，其中半导体器件通过焊接连接件附接到衬底以形成组件，包括使用剪切元件向半导体施加加载力 设备。 将衬底和半导体器件的组件装载到具有剪切元件靠近半导体器件的固定装置中，并且将固定装置中的组件的焊接连接件加热到基板附近加热到预定温度，通过将热源施加到 衬底远离半导体器件的表面。

公开(公告)号：US20070057024A1

公开(公告)日：2007-03-15

申请号：US11551754

申请日：2006-10-23

申请人： Lannie Bolde ,  James Covell ,  Mark Kapfhammer

发明人： Lannie Bolde ,  James Covell ,  Mark Kapfhammer

IPC分类号： A47J36/02

CPC分类号： H01L21/67144 ,  B23K1/018

摘要： A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.

摘要翻译： 公开了一种用于将芯片从衬底上分离的方法和结构，其将剪切力的传递延迟到芯片，直到将芯片附接到衬底的连接器足够柔软，使得剪切力的传递不会损坏芯片的连接器。 更具体地，剪切力由双金属盘产生，当加热时，双金属盘被转化为剪切力。 剪切力由延迟装置延迟，直到将芯片连接到基板的连接器足够柔软，使得施加剪切力将使芯片与基板分离而不损坏芯片的连接器。 该延迟装置包括物理间隙，该物理间隙可以被调整以控制何时施加剪切力到芯片。